Power Electronic Assembly With Embedded Laminate Inlay
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Solution Overview
Problem
In power electronic applications, effective cooling of power semiconductor components is hindered by the poor thermal conductivity of typical thermal interface materials, limiting achievable power output and exacerbating heat dissipation challenges in smaller package sizes.
Innovation Solution
A power electronic assembly with a multilayer board design, where a primary thermal conduction path is created using a thicker intermediary metal layer electrically isolated from a thermal contact layer but thermally connected, enhancing heat transfer efficiency and separating electrical and thermal domains.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If typical thermal interface materials are used to provide electrical insulation, then electrical insulation is achieved, but thermal conductivity deteriorates creating a bottleneck in heat transfer
Solution Approach 1:
The invention divides the board into multiple functional metal layers (first metal layer for electrical contacts, second metal layer for thermal contact, third metal layer for current distribution, fourth metal layer as primary thermal conduction path) separated by electrically insulating layers. This segmentation allows each layer to perform its specific function optimally while maintaining electrical insulation between conductive elements.
Solution Approach 2:
The fourth metal layer acts as an intermediary thermal conduction path between the power device and the second metal layer thermal contact. It provides a dedicated thermal pathway that is electrically isolated from the thermal contact layer but thermally connected, effectively mediating the heat transfer while maintaining electrical insulation.
2Power
If power semiconductor components are embedded in smaller package sizes to increase power density, then power output increases, but heat dissipation becomes more difficult
Solution Approach 1:
The invention transitions from planar heat dissipation to three-dimensional heat management by creating a vertical thermal pathway through multiple metal layers. The fourth metal layer provides a dedicated thermal conduction path that extends through the board structure, allowing heat to be conducted away in the vertical dimension rather than relying solely on lateral heat spread.
Solution Approach 2:
The board employs a composite structure combining multiple metal layers with different functions (electrical contacts, thermal contact, current distribution, thermal conduction) separated by electrically insulating layers. This composite material approach allows simultaneous optimization of electrical performance, thermal management, and mechanical integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves thermal performance by providing a more efficient heat transfer path, reducing thermal resistance, and allowing for standard molded power packages while enabling finer pitch SMT on PCBs, thus increasing power output and reducing I2R losses.
Implementation Method 1
a fourth metal layer of the board is positioned between the second metal layer and the power device and configured as a primary thermal conduction path for heat generated by the power device
Implementation Method 2
a first electrically insulating layer of the board separates the fourth metal layer from the second metal layer so that the fourth metal layer is electrically isolated from but thermally connected to the second metal layer
Implementation Method 3
a first electrically insulating layer of the board separates the fourth metal layer from the second metal layer so that the fourth metal layer is electrically isolated from but thermally connected to the second metal layer
Data Source
AI summary
A power electronic assembly includes a board having metal layers laminated onto or between electrically insulating layers, and a laminate inlay embedded in the board. A first metal layer provides electrical contacts at a first side of the board. A second metal layer provides a thermal contact at a second side of the board. A third metal layer is positioned between the first metal layer and the laminate inlay and configured to distribute a load current switched by the laminate inlay. A fourth metal layer is positioned between the second metal layer and the laminate inlay and configured as a primary thermal conduction path for heat generated by the laminate inlay during switching of the load current. A first electrically insulating layer separates the fourth metal layer from the second metal layer so that the fourth metal layer is electrically isolated from but thermally connected to the second metal layer.