Power Electronic Module Cooling Air Passageway Configuration
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Power electronic devices, such as motor drives, face challenges with heat dissipation due to compact packaging, leading to increased failure rates and limited motor speed as the inverter circuitry overheats, necessitating an improved cooling mechanism.
Innovation Solution
The proposed solution involves an air passageway configuration that directs cooling air to bypass a portion of the heatsink adjacent to the rectifier circuitry and impinges on the lateral surface of the heatsink near the inverter circuitry, creating a turbulent airflow to enhance heat dissipation, particularly for the IGBTs, by shifting cooling air from upstream to downstream locations and imparting an angular flow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If cooling air is directed through a conventional heatsink channel from upstream to downstream, then the heatsink can be compact, but the inverter circuitry at the downstream end experiences diminished cooling effect
Solution Approach 1:
The cooling air flow is segmented into two distinct paths: a first passageway that directs cooling air to the upstream end of the heatsink, and a second passageway that directs cooling air to the downstream end of the heatsink. This segmentation allows independent optimization of cooling for different circuitry locations, ensuring the inverter circuitry receives adequate cooling despite the compact heatsink design.
Solution Approach 2:
Different portions of the heatsink are provided with different cooling air flow characteristics tailored to their specific thermal requirements. The upstream end receives cooling air through the first passageway while the downstream end receives cooling air through the second passageway, creating localized cooling zones that address the specific temperature needs of different circuitry components.
2Loss of energy
If cooling air flow is increased to improve heat dissipation, then heat dissipation efficiency improves, but airflow resistance and pressure drop increase
Solution Approach 1:
The cooling air flow is divided into multiple streams through separate passageways, allowing each stream to be optimized for its specific destination. This segmentation enables improved heat dissipation efficiency while managing pressure drops by distributing the flow rather than forcing a single high-volume flow through a single path.
Solution Approach 2:
The cooling air flow is directed not only along the length of the heatsink but also impinged upon the lateral surface of the heatsink. This multi-dimensional approach to airflow increases heat dissipation efficiency by accessing heat from multiple surfaces while the air directing structure manages pressure characteristics.
3Productivity
If the power output is increased to improve productivity, then motor speed can be increased, but the temperature of inverter circuitry increases causing higher failure rates
Solution Approach 1:
The cooling system is segmented into multiple passageways that independently cool different circuitry, ensuring that the inverter circuitry receives dedicated cooling even at high power outputs. This segmentation allows the system to operate at higher motor speeds while maintaining reliable temperature control to prevent component failure.
Solution Approach 2:
The downstream end of the heatsink is provided with enhanced cooling through the second passageway that directs cooling air specifically to the inverter circuitry area. This localized cooling quality allows the system to handle higher power outputs and motor speeds while maintaining the reliability needed to prevent thermal failure of the inverter components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces the temperature of the IGBTs and driver circuitry, increasing the reliability and allowing motor drives to operate at higher speeds by improving heat dissipation and airflow distribution within the motor drive unit.
Implementation Method 1
the air directing structure is chosen to provide a turbulent air flow in the heat dissipating structure within the vicinity of the inverter circuitry
Implementation Method 2
an air passageway with an air directing structure configured to provide an air flow that impinges on a lateral surface of the heatsink
Data Source
AI summary
An improved cooling mechanism for a power electronics device is provided. More specifically, a cooling mechanism is provided that includes an air passageway configured to allow cooling air to bypass a portion of a heatsink adjacent to the rectifier circuitry and direct cooling air into an area of the heatsink that is nearer to the inverter circuitry. Another embodiment employs an air passageway with an air directing structure configured to provide an air flow that impinges on a lateral surface of the heatsink. In another embodiment, the air directing structure is chosen to provide a turbulent air flow in the heat dissipating structure within the vicinity of the inverter circuitry.