Power Electronic Module with Integrated Discrete Cooling Channel

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Solution Overview

Problem

Conventional power electronics modules are bulky due to the need for a single large printed circuit board and cooling channel, as the cooling channels are machined into one side of the housing, preventing the stacking of printed circuit boards.

Innovation Solution

The power electronic modules incorporate a discrete cooling channel with fluid inlet and outlet ports, allowing printed circuit boards to be positioned on opposite sides of the channel, which is integrated into the module, using a core housing made of injection molded thermoplastic and an external housing of stamped sheet metal, enabling separate fabrication and reduced mass.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If cooling channels are machined into one side of the housing, then the cooling structure is simple to manufacture, but the package size increases and printed circuit boards cannot be stacked

Engineering Contradiction:

Improvecooling channel fabricationVSAvoidmodule package size

Core Design Contradiction:

Ease of manufactureVSVolume of stationary object

Solution Approach 1:

The housing is divided into two separate parts: a first housing portion with a cooling channel and a second housing portion without. This segmentation allows the cooling channel to be positioned between stacked printed circuit boards, enabling vertical integration and reducing the overall package size while maintaining manufacturing simplicity through separate fabrication of housing portions

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The cooling channel is repositioned from a lateral configuration (machined into one side of the housing) to a vertical configuration (positioned between stacked printed circuit boards in the vertical dimension). This dimensional change enables multiple printed circuit boards to be stacked vertically while still providing effective cooling, thereby reducing the horizontal package size

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Device complexity

If a single large printed circuit board is used, then the cooling channel can be positioned on one side, but the module requires a large package size

Engineering Contradiction:

Improvecooling channel positioningVSAvoidmodule package size

Core Design Contradiction:

Device complexityVSVolume of stationary object

Solution Approach 1:

The single large printed circuit board is replaced with multiple smaller printed circuit boards stacked vertically. This segmentation allows each board to be positioned on opposite sides of the cooling channel, enabling the cooling channel to be centrally located in the vertical stack and significantly reducing the horizontal package size while maintaining all necessary electronic functions

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The layout transitions from a horizontal arrangement (single large board with cooling channel on one side) to a vertical arrangement (multiple stacked boards with cooling channel in between). This dimensional reorganization allows the module to achieve a compact footprint by utilizing the vertical dimension for board stacking while keeping the cooling channel accessible

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Reliability

If cooling channels are welded closed to prevent leakage, then sealing is achieved, but the mass and manufacturing complexity increase

Engineering Contradiction:

Improvecooling fluid leakage preventionVSAvoidhousing fabrication process

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The cooling channel is extracted from the housing as a separate component rather than being an integral part of the housing. This allows the housing to be manufactured without complex welding or sealing operations, while the cooling channel itself can be separately sealed or designed with integrated sealing features, thereby reducing the overall manufacturing complexity and mass

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The housing is segmented into separate portions that can be assembled around the cooling channel. This segmentation eliminates the need for welding the cooling channel into the housing, as the portions can be mechanically assembled with integrated sealing, thereby simplifying the manufacturing process while maintaining leakage prevention

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design reduces the package size and mass of the modules while allowing for efficient heat transfer through the use of thermal interface materials, facilitating a compact and lightweight power electronic device.

Implementation Method 1

first and second printed circuit board assemblies positioned in the housing on opposite sides of the discrete cooling channel and being in thermal contact with opposite heat-absorbing surfaces of the discrete cooling channel

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

cooling channel having fluid inlet and outlet ports for flow of a coolant

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS11284504B2Power electronic module with integrated cooling channel

Publication Date: 2022.03.22 KOSTAL OF AMERICA

AI summary

A power electronic module having reduced mass and/or reduced package size as compared with conventional modules employing die cast materials, secondary machining, and/or welding operations includes a housing, a discrete cooling channel positioned in the housing and having opposing cooling surfaces, and first and second printed circuit board assemblies disposed on opposite sides of the cooling channel.