Power Electronics Module Base Plate with Carbon-Based Thermal Spreading

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Solution Overview

Problem

Conventional aluminum heat sinks struggle to efficiently manage high heat loss densities in power electronics modules, leading to increased heatsink-to-baseplate and chip-to-junction temperatures due to high thermal resistance, necessitating more costly and complex cooling solutions.

Innovation Solution

A power electronics module with a base plate featuring a layered structure of copper layers and a carbon-based layer, such as graphite or graphene, where the carbon-based material forms a core surrounded by copper, enhancing heat spreading and transfer through thermal vias, allowing for effective heat management without the need for high-cost cooling solutions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If conventional aluminum heat sinks are used, then manufacturing cost is low, but thermal resistance is high leading to insufficient heat dissipation

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidmanufacturing cost

Core Design Contradiction:

Loss of energyVSEase of manufacture

Solution Approach 1:

The base plate uses a composite structure combining copper layers with a carbon-based material layer (graphite or graphene). This composite material provides superior in-plane thermal conductivity compared to conventional aluminum heat sinks, enabling effective heat spreading from high-density heat sources while maintaining manufacturing feasibility through layer-by-layer construction

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The carbon-based material layer is strategically positioned between copper layers at the base plate's heat-generating region to provide localized high thermal conductivity for heat spreading. Thermal vias with copper material are placed at specific locations to create localized high-conductivity pathways, optimizing heat transfer precisely where needed rather than uniformly throughout the entire base plate

Inventive Principle:

Principle #3Local quality

2Productivity

If power electronics module packing density increases, then component integration improves, but heat spot density increases making cooling more difficult

Engineering Contradiction:

Improvemodule packing densityVSAvoidheat spot density

Core Design Contradiction:

ProductivityVSTemperature

Solution Approach 1:

The base plate structure provides localized high thermal conductivity regions: the carbon-based material layer is positioned directly beneath high-density heat sources to spread heat laterally, while thermal vias create localized vertical heat pathways. This localized optimization allows the base plate to handle concentrated heat from high-density packaging without requiring uniform overheating of the entire structure

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The multi-layer composite base plate with copper and carbon-based materials creates a structure with spatially varying thermal conductivity properties. The carbon-based layer provides exceptional in-plane thermal conductivity for heat spreading, while copper layers and thermal vias provide vertical heat transfer pathways, enabling the system to manage heat from increasingly dense power electronics packaging

Inventive Principle:

Principle #40Composite materials

3Loss of energy

If copper base plate is used instead of aluminum, then thermal conductivity improves, but manufacturing cost increases

Engineering Contradiction:

Improvethermal conductivityVSAvoidmanufacturing cost

Core Design Contradiction:

Loss of energyVSEase of manufacture

Solution Approach 1:

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The base plate is segmented into multiple functional layers: copper layers for vertical heat conduction, carbon-based material layer for lateral heat spreading, and thermal vias for localized heat pathways. This segmentation allows each layer to be optimized for its specific function and manufactured using appropriate processes, then assembled into the complete base plate structure

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The carbon-based layer with high in-plane thermal conductivity effectively spreads heat within the base plate, reducing hot spots and allowing for the use of lower-cost heat sink solutions by improving heat transfer efficiency to cooling devices.

Implementation Method 1

The base plate is provided with a layered structure having a first copper layer, a second copper layer and a carbon based material layer between the copper layers

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The base plate further comprises at least one thermal via formed of a copper pillar for enhancing the heat transfer through the base plate

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20180226318A1Power electronics module

Publication Date: 2018.08.09 ABB (SCHWEIZ) AG

AI summary

A power electronics module and a method of manufacturing a power electronics module and a base plate. The power electronics module comprising at least one power electronics component, wherein the power electronics module comprises a base plate for transferring heat generated by the at least one power electronics component to a cooling device, the base plate comprising a layered structure having a first copper layer, a second copper layer and a carbon based layer between the first and second copper layers.