Heat Pump Power Electronics Cooling Bypass Against Condensation
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Solution Overview
Problem
Existing heat pump devices face inefficiencies in cooling their power electronics, which can lead to moisture condensation and potential damage due to inadequate cooling control.
Innovation Solution
A heat pump device with a cooling unit that includes a bypass system for the power electronics, allowing adjustable flow of the heating water through the cooling channels and bypass, controlled by a temperature sensor and control unit to manage cooling medium flow based on the power electronics' temperature.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the power electronics unit is cooled using heating water from the heat pump, then the power loss of the power electronics can be supplied as useful power, but the temperature of the power electronics unit may fall so low that moisture condenses on the components
Solution Approach 1:
The cooling system dynamically adjusts the flow of heating water through the power electronics unit based on temperature conditions. When the power electronics temperature is above a first threshold, cooling is active; when it drops below a second threshold, cooling is reduced or stopped, preventing moisture condensation while maximizing heat recovery
2Reliability
If a cooling unit is provided for the power electronics, then effective cooling control is achieved, but the device complexity increases with additional cooling channels and control mechanisms
Solution Approach 1:
The cooling unit for the power electronics is integrated with the existing heating water circuit of the heat pump. The same heating water that would otherwise be discarded is redirected through the power electronics unit, combining the cooling function with the existing thermal management system and minimizing additional complexity
Solution Approach 2:
The heating water circuit serves dual functions: it provides cooling for the power electronics unit when needed, and maintains its primary heating function. The system universally uses the same thermal fluid (heating water) for both heating and cooling purposes depending on operational conditions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively regulates the cooling of power electronics, preventing moisture condensation and ensuring efficient heat dissipation, thereby enhancing the operational reliability and efficiency of the heat pump.
Implementation Method 1
a cooling unit (120) for cooling the power electronics unit (110)... a cooling duct (121) for cooling the power electronics unit (110)
Implementation Method 2
The power electronics unit (110) is liquid-cooled by the cooling unit (120)... heating return (10) and heating flow (20) are connected to the cooling unit (120)
Implementation Method 3
The cooling unit (120) uses the heating water or service water, which is to be heated by the heat pump device, to cool the power electronics unit
Data Source
Figure 1~2B
Figure 2C~2D
Figure 3
AI summary
The invention relates to a heat pump device with an evaporator (130), a speed-controllable compressor (140), an expansion valve (150), a condenser (160), a power electronics unit (110) for controlling the speed-controllable compressor (140) and a Cooling unit (120) for cooling the power electronics unit (110). The cooling unit (120) has at least one cooling duct (121) for cooling the power electronics unit (110), a bypass (122) parallel to the at least one cooling duct (121) and an adjustment unit (123, 124, 125, 126) for adjusting a cooling medium -Volume flow through the bypass (122).