Liquid Cooling System for Power Electronics
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Solution Overview
Problem
Power electronics systems in vehicles require tailored cooling solutions for components with varying thermal capacities and heat dissipation needs, as current systems fail to efficiently address the distinct cooling requirements of power electronics switching devices and condenser devices.
Innovation Solution
A multipart housing with a liquid cooling system featuring multiple cooling chambers and a specific flow sequence, where the condenser device is cooled on both sides with minimal pressure loss, and power electronics switching devices are cooled with higher pressure loss to accommodate their respective thermal capacities and heat dissipation needs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single cooling system is used for all power electronics components, then the system structure is simple, but the cooling efficiency is insufficient due to different thermal capacities and heat dissipation needs of different components
Solution Approach 1:
The cooling system is divided into multiple independent cooling chambers (first upper cooling chamber, first lower cooling chamber, second lower cooling chamber) that can be separately configured and optimized for different components. Each chamber can be tailored to the specific thermal requirements of the components it cools, thereby improving cooling efficiency without significantly increasing overall system complexity.
Solution Approach 2:
Different cooling chambers are designed with different structural characteristics and cooling capacities to match the local thermal requirements of specific components. For example, chambers cooling power electronics switching devices are designed to handle higher heat quantities, while chambers cooling condenser devices are designed for lower heat quantities but with stricter temperature control requirements.
2Loss of energy
If the cooling liquid flow path is optimized for minimal pressure loss, then energy efficiency is improved, but the cooling capacity may be insufficient for high heat dissipation components
Solution Approach 1:
The cooling system divides the flow path into separate chambers, allowing each chamber to be optimized for its specific function. Chambers handling high heat dissipation can tolerate higher pressure losses, while chambers requiring low pressure loss are designed with optimized flow paths.
Solution Approach 2:
Different sections of the cooling system have different pressure loss characteristics matched to their functional requirements. The system accepts higher pressure losses in chambers where high heat dissipation is the priority, while maintaining low pressure losses in chambers where temperature control is more critical.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures efficient and uniform cooling for both condenser and power electronics switching devices, maintaining optimal cooling conditions with low pressure loss and temperature increase, thereby improving the overall cooling efficiency and thermal management in power electronics systems.
Implementation Method 1
a liquid cooling system having at least one first upper cooling chamber between the central element and the upper cover element, and at least two first and second lower cooling chambers between the central element and the lower cover element, the upper and lower cooling chambers configured for circulation of the cooling liquid
Data Source
AI summary
A power electronics system includes a multipart housing having three housing elements of cuboid basic structure to define a central element with inlet and outlet ports for a cooling liquid, an upper and lower cover elements which are arranged on opposite connection surfaces of the central element. A plurality of power electronics switching devices is accommodated in the housing, and a condenser device having condenser connection elements is arranged in the central element of the housing> Further provided is a liquid cooling system having at least one first upper cooling chamber between the central element and the upper cover element, and at least two first and second lower cooling chambers between the central element and the lower cover element. The upper and lower cooling chambers are configured for circulation of the cooling liquid entering through the inlet port and exiting through the outlet port of the housing.