Power Electronics Cooling Assembly with Direct Thermal Contact
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Solution Overview
Problem
Conventional printed circuit board embedded power electronics modules have intermediate layers that impede heat dissipation from power electronics devices to heat sinks, leading to increased thermal resistance and higher operating temperatures.
Innovation Solution
The power electronics modules feature power electronics devices in direct contact with conductive substrates, which are in direct contact with an electrically-insulating layer that is in turn directly contacted by a heat sink, minimizing intermediate components and thus reducing thermal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If intermediate layers are positioned between power electronics devices and heat sink, then electrical insulation is provided, but thermal resistance increases and heat dissipation is impeded
Solution Approach 1:
The patent uses an electrically-insulating layer as an intermediary component that provides electrical insulation between the conductive substrate and heat sink while maintaining direct thermal contact. This mediator resolves the contradiction by allowing electrical isolation without compromising thermal transfer, as the insulating layer is positioned to block electrical current paths while preserving thermal conduction pathways from the power electronics devices through the conductive substrate to the heat sink.
2Strength
If intermediate components are positioned between power electronics devices and heat sink, then structural support is provided, but thermal resistance increases
Solution Approach 1:
The patent merges the electrical insulation function and structural support function into a single integrated electrically-insulating layer that is in direct contact with both the conductive substrate and heat sink. This consolidation eliminates the need for separate intermediate structural components that would impede heat flow, as the insulating layer provides both mechanical support and thermal pathway maintenance simultaneously.
3Temperature
If direct contact configuration is used between conductive substrate and heat sink, then thermal resistance is minimized, but electrical insulation must be maintained
Solution Approach 1:
The patent applies local quality by positioning the electrically-insulating layer specifically at the interface between the conductive substrate and heat sink, creating a localized insulation barrier only where electrical isolation is required. This allows direct thermal contact and minimized thermal resistance across the overall assembly, while the insulating layer provides electrical isolation precisely at the critical interface without interfering with the thermal pathway.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation from power electronics devices, allowing them to operate at lower temperatures and higher power outputs while maintaining similar operating temperatures compared to conventional configurations.
Implementation Method 1
power electronics devices in direct contact with conductive substrates that are in direct contact with an electrically-insulating layer. The electrically-insulating layer is in direct contact with a heat sink. The direct contact between the conductive substrates and the heat sink with the electrically-insulating layer minimizes intermediate components positioned between the power electronics devices and the heat sink, thereby minimizing thermal resistance
Data Source
AI summary
A power electronics module includes a heat sink structurally configured to dissipate thermal energy, an electrically-insulating layer directly contacting the heat sink, a conductive substrate positioned on and in direct contact with the electrically-insulating layer, a power electronics device positioned on and in direct contact with the conductive substrate, a printed circuit board layer that at least partially encapsulates the conductive substrate and the power electronics device, and a driver circuit component positioned on a surface of the printed circuit board layer.