Power Electronics Cooling System with Dual Temperature Zones
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Solution Overview
Problem
Modern power electronics systems face operational inconsistencies and potential component damage due to temperature extremes, as different electronic components on a printed circuit board have varying normal operating maximum temperatures, and electromagnetic interference (EMI) can affect their performance.
Innovation Solution
A power electronics system is designed with an outer zone and inner zones, where the first electronic components with higher operating temperatures generate EMI, and a heat transfer assembly is used to maintain second electronic components within the inner zones at or below their normal operating maximum temperature by transferring heat to the outer zone, while the inner zones are electromagnetically sealed to prevent interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If electronic components with different operating temperature ranges are mounted on the same printed circuit board, then the system can integrate multiple functions, but the components cannot operate reliably when environmental temperature exceeds the lowest operating maximum temperature
Solution Approach 1:
The patent divides the electronic system into multiple temperature zones using thermal barriers and insulation structures. High-temperature components (e.g., power electronics) are isolated from low-temperature components (e.g., microprocessors) through physical segmentation, allowing each zone to operate within its optimal temperature range even when environmental conditions vary.
Solution Approach 2:
The patent applies localized thermal management by providing different thermal characteristics to different regions of the circuit board. Thermal vias, heat sinks, and insulation materials are strategically placed to create localized thermal environments suitable for specific component types, rather than applying a uniform thermal approach across the entire board.
2Device complexity
If a single cooling system is used for all electronic components, then the system structure is simple, but components with different temperature requirements cannot be properly cooled
Solution Approach 1:
The cooling system is segmented into multiple independent cooling channels or zones, each tailored to the thermal requirements of specific component groups. This allows differential cooling strategies to be applied without requiring a completely separate cooling system for each component.
Solution Approach 2:
Thermal management intermediaries such as thermal barriers, heat spreaders, and phase change materials are introduced between heat-generating components and the cooling system. These intermediaries enable precise temperature control by mediating heat transfer and allowing the cooling system to operate at optimal efficiency while maintaining different temperature zones.
3Volume of moving object
If high-power electronic components are placed close to low-power components, then the device size is reduced, but electromagnetic interference affects the performance of sensitive components
Solution Approach 1:
The patent segments the circuit board into electromagnetic zones separated by shielding structures, ground planes, and isolation barriers. High-power components generating EMI are isolated from sensitive low-power components through these segmented boundaries, allowing compact layout while maintaining electromagnetic compatibility.
Solution Approach 2:
Electromagnetic shielding materials and ground plane intermediaries are placed between high-power and low-power components. These intermediaries block or redirect electromagnetic fields, preventing interference while allowing the components to remain in close proximity for compact device design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively maintains second electronic components within their safe temperature range, reduces EMI, and ensures consistent operation by transferring heat from the inner to the outer zone, thereby enhancing thermal performance and protecting components from excessive temperatures.
Implementation Method 1
a heat transfer assembly coupled to the at least one inner wall, wherein the heat transfer assembly is configured to facilitate operating the plurality of second electronic components below the second normal operating maximum temperature by transferring heat from the inner zone to the outer zone
Data Source
AI summary
A power electronics system is provided. The system includes at least one outer wall defining an outer zone including a plurality of first electronic components having a first normal operating maximum temperature and capable of generating electromagnetic fields. The system further includes at least one inner wall defining an inner zone disposed within the outer zone and including a plurality of second electronic components having a second normal operating maximum temperature, the first normal operating maximum temperature higher than the second normal operating maximum temperature, the inner zone substantially electromagnetically sealed against electromagnetic interference generated by the plurality of first electronic components. The system further includes a heat transfer assembly coupled to the at least one inner wall and configured to facilitate operating the plurality of second electronic components below the second normal operating maximum temperature by transferring heat from the inner zone to the outer zone.