Power electronics cooling loop for refrigerant compressor
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Solution Overview
Problem
Existing refrigerant systems for chillers and heat pumps face challenges in effectively cooling power electronics, leading to higher operating temperatures and potential safety and reliability issues due to high evaporator temperatures, especially when the temperature exceeds 20°C.
Innovation Solution
A refrigerant system with a heat exchanger that uses a separate refrigeration cycle to cool power electronics, incorporating an oil-free centrifugal compressor, a heat sink with louvered fins, and active control of refrigerant and air flow to enhance heat dissipation, allowing for efficient heat transfer and temperature regulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If refrigerant is used to cool power electronics in the main loop, then cooling is provided to the motor and power electronics, but evaporator temperature exceeds 20°C causing safety and reliability issues
Solution Approach 1:
The patent divides the cooling function into two separate loops: a main refrigerant loop for the heat pump system and a separate electronic cooling loop for power electronics. The electronic cooling loop includes its own evaporator, compressor, and expansion device, allowing independent temperature control for power electronics without affecting the main loop evaporator temperature, thus resolving the reliability issue while maintaining effective cooling.
Solution Approach 2:
The patent introduces an intermediary electronic cooling loop that acts as a mediator between the main refrigerant loop and the power electronics. This intermediate system uses refrigerant from the main loop (via a refrigerant source) but processes it through a separate evaporator and expansion device, enabling precise temperature control for power electronics while maintaining the main loop's evaporator temperature below 20°C for safety and reliability.
2Volume of moving object
If compact design is implemented, then system size is reduced, but heat dissipation capability is limited
Solution Approach 1:
The patent employs nesting by placing the electronic cooling loop components within or alongside the main heat pump system components. The electronic evaporator, compressor, and expansion device are integrated into the overall system architecture, allowing the compact design to maintain effective heat dissipation capability while minimizing system volume.
Solution Approach 2:
The patent merges the electronic cooling loop with the main heat pump system by using shared components where possible (such as the refrigerant source from the main loop) while maintaining separate functional paths. This combining approach reduces overall system volume while preserving the heat dissipation capability of the electronic cooling system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively cools power electronics, preventing overheating and enabling the system to operate within a broader temperature range, thus improving safety and reliability while maintaining a compact design.
Implementation Method 1
A heat exchanger has a cooling line, which is configured to receive refrigerant from the main refrigerant loop
Implementation Method 2
The heat sink has a plurality of fins in flow contact with the air
Implementation Method 3
The heat sink has a plurality of fins in flow contact with the air. The plurality of fins have a louvered arrangement
Implementation Method 4
The plurality of fins have a fin height between 8 mm and 24 mm
Implementation Method 5
liquid refrigerant to enter an expansion valve and then the heat exchanger via an inlet
Implementation Method 6
The refrigerant and the air to the heat exchanger are actively controlled
Data Source
AI summary
A refrigerant system according to an example of this disclosure includes a main refrigerant loop in communication with a condenser, an evaporator, and a compressor. A heat exchanger is arranged to cool electronic components. The heat exchanger has a cooling line, which is configured to receive refrigerant from the main refrigerant loop and a heat sink in communication with air surrounding the electronic components.