Power Electronics Cooling Assemblies with Embedded Manifold
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Solution Overview
Problem
Conventional power electronics modules embedded in printed circuit boards face inefficiencies in heat dissipation due to intermediate layers between the power electronics devices and heat sinks, leading to increased thermal resistance and higher operating temperatures, which limits their power output and increases assembly costs and leakage risks.
Innovation Solution
A power electronics module design featuring a heat sink base layer directly bonded to a cold plate manifold without mechanical fasteners, with engagement features embedded within the manifold, and power electronics devices in direct contact with conductive substrates and an electrically-insulating layer, minimizing thermal resistance and eliminating intermediate components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If intermediate layers are positioned between power electronics devices and heat sink, then assembly is simplified, but thermal resistance increases and heat dissipation efficiency decreases
Solution Approach 1:
The patent removes intermediate layers (thermal interface materials, adhesives, and mechanical fasteners) from the thermal path between power electronics devices and the cold plate manifold. This extraction of unnecessary intermediate components directly reduces thermal resistance while the engagement features provide alternative mechanical attachment without compromising thermal performance.
2Strength
If mechanical fasteners and sealing elements are used to couple heat sink to power electronics module, then structural integrity is ensured, but assembly cost increases and leakage risk remains
Solution Approach 1:
The patent merges the mechanical attachment function and the thermal conduction function into a single integrated heat sink base layer with engagement features. The engagement features protruding from the cold plate manifold directly couple to the heat sink base layer, eliminating the need for separate mechanical fasteners and sealing elements, thereby reducing assembly complexity and leakage risk while maintaining structural integrity.
Solution Approach 2:
The engagement features act as intermediary elements that simultaneously provide mechanical coupling and maintain thermal contact between the cold plate manifold and heat sink base layer. These features eliminate the need for separate fasteners and seals by directly bridging the two components in both mechanical and thermal domains.
3Reliability
If multiple intermediate components are used between power electronics devices and cold plate manifold, then electrical insulation is achieved, but thermal resistance increases
Solution Approach 1:
The patent applies local quality by positioning the electrically-insulating layer only where electrical isolation is required (between conductive substrates and cold plate manifold), while maintaining direct thermal contact through the heat sink base layer with engagement features. This localized insulation approach ensures electrical safety without compromising the thermal path, as the insulation is applied selectively rather than throughout the entire thermal interface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation, allowing power electronics devices to operate at lower temperatures and higher power outputs while reducing assembly costs and minimizing cooling fluid leakage.
Implementation Method 1
power electronics devices in direct contact with conductive substrates that are in direct contact with an electrically-insulating layer. The electrically-insulating layer is in direct contact with a cold plate manifold. The direct contact between the conductive substrates and the cold plate manifold with the electrically-insulating layer minimizes intermediate components positioned between the power electronics devices and the cold plate manifold, thereby minimizing thermal resistance
Implementation Method 2
pressing the heat sink base layer into a plastic cold plate manifold and heating the heat sink base layer, thereby melting at least a portion of the plastic cold plate manifold to couple the heat sink base layer to the plastic cold plate manifold
Data Source
AI summary
A power electronics module includes a cold plate manifold, a heat sink base layer at least partially embedded in the cold plate manifold, an electrically-insulating layer in direct contact with the heat sink base layer, a conductive substrate positioned on the electrically-insulating layer, and a power electronics device coupled to and in direct contact with the conductive substrate.