Power Electronics Gasket Seal for Thermal Interface Material Retention

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Solution Overview

Problem

Existing heat exchangers struggle to maintain optimal operating temperatures for power electronic devices under varying load conditions, leading to efficiency degradation and potential thermal damage.

Innovation Solution

A heat exchanger assembly with a gasket that forms a seal around the heat sink interface to retain thermal interface material, ensuring effective thermal conductivity and preventing material loss due to gravity or condensation, using a gasket that can be compressed to form a seal between the heat sink and housing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If thermal interface material is used to bond power electronic devices to the heat exchanger, then thermal conductivity is improved, but the material can flow out due to gravity or condensation

Engineering Contradiction:
Improvethermal conductivityVSAvoidthermal interface material loss
Core Design Contradiction:
TemperatureVSLoss of substance

Solution Approach 1:

The patent extracts the thermal interface material from an unconfined state and places it within a sealed enclosure formed by the gasket, preventing material loss while maintaining thermal conductivity. The gasket creates a contained space that holds the material in place.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The gasket is installed beforehand to create a seal that prevents the thermal interface material from flowing out due to gravity or condensation before the material can be applied, thereby preventing material loss proactively.

Inventive Principle:
Principle #9Preliminary anti-action

2Loss of substance

If a gasket is added to seal the thermal interface material, then material loss is prevented, but device complexity increases

Engineering Contradiction:
Improvethermal interface material retentionVSAvoidheat exchanger assembly complexity
Core Design Contradiction:
Loss of substanceVSDevice complexity

Solution Approach 1:

The patent uses a flexible gasket made of elastomeric or rubber material that can be compressed to form an effective seal. This flexible component prevents material loss without requiring a complex rigid sealing mechanism.

Inventive Principle:
Principle #30Flexible shells and thin films

Solution Approach 2:

The gasket is integrated with the heat exchanger assembly in a straightforward manner, combining the sealing function with the existing structure. The gasket fits into a groove or channel on the heat exchanger surface, merging multiple functions into a unified design.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enhances thermal conductivity and maintains optimal operating temperatures, extending the life of power electronic components by preventing thermal interface material loss and improving heat transfer efficiency.

Implementation Method 1

The gasket may be compressed to form a seal between the heat sink interface and the surface of the housing of the heat exchanger

Methodology Applied
Scientific EffectCompression: Compression

Implementation Method 2

A thermal interface material, such as thermal grease, can be disposed between the heat sink interface and the heat exchanger

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentEP4171185B1Seal for thermal interface material of power electronics modules
Publication Date: 2025.08.20 CARRIER CORP
  • EP4171185B1 patent drawingFigure 1
  • EP4171185B1 patent drawingFigure 2
  • EP4171185B1 patent drawingFigure 3

AI summary

A heat exchanger assembly includes a heat exchanger (20) and a power electronics module (50) mounted to the heat exchanger (20). The power electronics module (50) is thermally coupled to the heat exchanger (20) at a heat sink interface (56). A thermal interface material (58) is arranged between the heat sink interface (56) and a surface (52) of the heat exchanger (20) and a gasket (60) arranged between the heat sink interface (56) and the surface (52) of the heat exchanger (20).