Power Electronics Housing With Dielectric Impingement Cooling
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Solution Overview
Problem
Power electronics modules in hybrid and electric vehicles generate significant heat, leading to increased costs and weight due to large cooling systems, which are also prone to failure, necessitating more efficient and compact cooling solutions.
Innovation Solution
A system utilizing a housing with a manifold to direct a dielectric fluid, such as synthetic hydrocarbons, to contact both sides of the power electronics module, combined with electrical connections and fins to enhance heat dissipation, creating a sealed environment for effective cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional cooling systems are used to remove heat from power electronics modules, then the heat dissipation function is achieved, but the system weight and cost increase significantly
Solution Approach 1:
The patent combines the cooling system with the housing structure by integrating cooling channels directly into the housing walls. The housing serves dual functions as both structural enclosure and heat dissipation pathway, eliminating separate cooling components and reducing overall system weight while maintaining effective heat removal from power electronics modules
Solution Approach 2:
The housing is designed to perform multiple functions simultaneously: it provides structural support, contains the power electronics module, and acts as a heat sink through integrated cooling channels. This multi-functionality reduces the need for additional dedicated cooling components, thereby reducing system weight and cost
2Temperature
If traditional cooling systems are used to remove heat from power electronics modules, then the heat dissipation function is achieved, but the system cost increases
Solution Approach 1:
The cooling channels are integrated directly into the housing structure during manufacturing, combining two components (housing and cooling system) into one. This reduces assembly steps, lowers manufacturing complexity, and decreases overall system cost while maintaining effective heat dissipation functionality
Solution Approach 2:
The housing performs multiple functions including structural support, electrical insulation, and heat dissipation through integrated channels. This multi-functionality eliminates the need for separate cooling components, reducing part count, assembly costs, and overall system manufacturing cost
3Temperature
If larger cooling systems are used to handle heat from power electronics, then heat dissipation capacity is improved, but the system volume increases
Solution Approach 1:
The cooling channels are nested within the walls of the housing structure itself. The heat dissipation pathways are embedded in the existing housing volume rather than adding external cooling components, effectively utilizing the housing material as part of the thermal management system and minimizing additional volume requirements
4Temperature
If complex cooling systems are used to improve heat dissipation, then cooling performance is improved, but the system complexity increases
Solution Approach 1:
The cooling system is merged with the housing structure, eliminating the need for separate cooling components, manifolds, and connections. The integrated design reduces the number of parts and assembly steps, simplifying the overall system while maintaining effective heat dissipation through the housing walls
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly reduces thermal resistance, making the cooling system more efficient, lighter, and cost-effective compared to existing automotive solutions, thereby improving the energy efficiency and battery range of electric vehicles.
Implementation Method 1
the fluid is configured to contact the power electronics module and the electrical connection inside the housing
Implementation Method 2
the manifold is configured to direct the fluid to contact the first side and the second side
Data Source
AI summary
The present disclosure relates generally to methods and devices for the cooling (or removal of heat from) power electronics modules in automotive vehicles, wherein the cooling is done by positioning the power electronics module in a housing, directing a fluid into the housing, and impinging the fluid onto the power electronics module and/or an electrical connection in contact with the power electronics module.