Power Electronics Module Aligned Recesses for Load Connections

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing power semiconductor modules have limited space for additional components due to conventional load connection designs, which hinder compactness and efficiency.

Innovation Solution

The power electronics module features a base plate with aligned recesses for load connection elements, allowing for plug contacts and additional components like capacitors, with a cooling device and insulation to enhance thermal management and space utilization.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of stationary object

If conventional load connection designs are used with plastic housings, then the module structure is simple, but the space for additional components is limited

Engineering Contradiction:
Improvespace for additional componentsVSAvoidmodule structure
Core Design Contradiction:
Volume of stationary objectVSDevice complexity

Solution Approach 1:

The load connection element extends vertically through the base plate and housing, utilizing the third dimension (height) to route connections. This allows additional components to be arranged horizontally in the interior space without interfering with load connections, effectively adding spatial freedom in another dimension.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The load connection element is nested within the housing structure, with its connecting section passing through the base plate and extending through the housing. This nested arrangement allows the connection element to occupy minimal space while still providing external access, creating room for additional components.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Ease of operation

If load connection elements extend laterally through the housing, then external contact is achieved, but the module compactness is reduced

Engineering Contradiction:
Improveexternal contactVSAvoidmodule compactness
Core Design Contradiction:
Ease of operationVSVolume of moving object

Solution Approach 1:

Instead of extending load connections laterally through the housing walls, the design routes the connecting section vertically through the base plate and up through the housing. This vertical routing in another dimension maintains external contact capability while preserving horizontal compactness.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Strength

If the base plate is solid without recesses, then structural strength is maintained, but load connection elements cannot pass through

Engineering Contradiction:
Improvebase plate strengthVSAvoidload connection passage
Core Design Contradiction:
StrengthVSEase of operation

Solution Approach 1:

The base plate is segmented by introducing a recess that allows the load connection element to pass through. This segmentation creates a localized opening for electrical connection while maintaining the overall structural integrity of the base plate through strategic placement and dimensional design of the recess.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enables a compact, efficient power electronics module with improved heat transfer and space for further components, enhancing performance and reliability.

Implementation Method 1

a base plate (4), in particular in the form of a cooling device

Methodology Applied
Scientific EffectHeat transfer: Conduction (thermal)

Data Source

PatentUS9768094B2Power electronics module with load connection elements
Publication Date: 2017.09.19 SEMIKRON DANFOSS ELEKTRONIK GMBH & CO KG
  • US9768094B2 patent drawing
  • US9768094B2 patent drawing
  • US9768094B2 patent drawing

AI summary

A power electronics module having a base plate, a circuit carrier arranged on the base plate and a plurality of conductor tracks which are electrically insulated from the base plate. A power semiconductor component is arranged on one of the conductor tracks, and has a load connection element. In this case, the base plate has a substantially continuous first recess and the circuit carrier has a substantially continuous second recess, wherein the first and second recesses are arranged such that they are in alignment with one another. The load connection element has a first contact device which is in electrically conductive contact with a contact area of that side of the conductor track which is averted from the base plate, a second contact device for externally making contact with the circuit carrier, and a connecting section, which extends through the first and second recesses, between the first and second contact devices.