Power Electronics Thermal Modeling via Virtual Network
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Solution Overview
Problem
Developing sophisticated thermal models for power electronic devices like LED drivers is complex and time-consuming, requiring significant computational resources, and full-scale models within larger simulation environments increase computational expenses, potentially losing the speed benefit of virtual models.
Innovation Solution
A method involving the generation of virtual models with a single heat source representing all heat-generating sources and thermal resistors representing connections to the housing, followed by thermal simulations to determine thermal parameters for a network model, allowing for simplified and compact thermal modeling of power electronics devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If sophisticated thermal models (FEM/CFD) are used for accurate temperature predictions, then measurement precision is improved, but device complexity and computational resources increase
Solution Approach 1:
The patent segments the complex thermal model into a simplified network model consisting of discrete thermal resistors and heat sources. This segmentation allows the model to maintain accuracy for prediction purposes while reducing overall complexity and computational requirements by dividing the thermal analysis into manageable resistive pathways.
Solution Approach 2:
The patent creates a simplified copy of the complex FEM/CFD thermal model in the form of a network model. This copy retains the essential thermal behavior and prediction accuracy but uses a much simpler structure with discrete thermal resistors, thereby reducing computational resources while maintaining measurement precision.
2Measurement precision
If full-scale models are used within larger simulation environments, then simulation accuracy is improved, but computational expenses increase significantly
Solution Approach 1:
The patent extracts the essential thermal characteristics from the full-scale FEM/CFD model and isolates them into a separate network model. This extracted model can be integrated into larger simulation environments without the computational burden of the original full-scale model, thereby maintaining simulation accuracy while significantly reducing computational expenses.
Solution Approach 2:
The patent transforms the continuous complex thermal field into discrete thermal resistance parameters. By changing the representation from continuous FEM/CFD parameters to discrete thermal resistor values, the model maintains accuracy for integration purposes while dramatically reducing computational resource requirements.
3Manufacturing precision
If detailed internal structures are modeled, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The patent segments the detailed internal thermal structures into equivalent thermal resistor networks. This segmentation allows the model to capture essential thermal pathways and manufacturing details without representing every internal structure explicitly, thereby maintaining manufacturing precision while reducing overall model complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient thermal modeling of power electronics devices, approximating overall thermal behavior while neglecting internal details, and allows for the adaptation of devices to avoid overheating, facilitating the development and manufacturing process.
Implementation Method 1
thermal resistors which are connected to the heat source, and which represent thermal connections of components of the power electronics device to each other and/or to a housing
Implementation Method 2
The components can be internal elements of the device which generate and/or dissipate heat when the device is in operation, e.g. by means of conduction, radiation and/or convention
Implementation Method 3
The components can be internal elements of the device which generate and/or dissipate heat when the device is in operation, e.g. by means of conduction, radiation and/or convention
Data Source
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AI summary
The invention relates to a method (10) of determining thermal behavior of a power electronics device, such as an LED driver. The method (10) comprises: generating (11) a number of virtual models (30) of the power electronics device, wherein each virtual model (30) comprises: a single heat source (31) which represents all heat-generating sources of the power electronics device, and a number of thermal resistors which are connected to the heat source (31), and which represent thermal connections of components of the power electronics device to each other and/or to a housing (32) of the power electronics device. The method (10) further comprises performing (13) a number of thermal simulations with the virtual models (30) to determine thermal parameters of a network model of the power electronics device.