Power Grid Stub Layout for Flexible Intra-Cell Routing

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Solution Overview

Problem

The miniaturization of integrated circuits poses challenges in design and manufacturing, requiring stricter specifications and improved circuit layout flexibility to accommodate power grid connections efficiently.

Innovation Solution

Incorporating power grid stubs in the circuit layout, which are aligned with vertical conducting lines and connected via via-connectors, increases the number of available vertical conducting lines for intra-cell routing, enhancing layout flexibility and potentially reducing cell size.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If power grid stubs are incorporated in the circuit layout, then layout flexibility and cell size are improved, but manufacturing complexity and design specifications become stricter

Engineering Contradiction:
Improvelayout flexibilityVSAvoidmanufacturing complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The power grid system is segmented into main power grid lines and stub connections, allowing independent optimization of each component. The stubs are discrete elements that can be selectively placed at specific locations along the power grid lines, providing flexibility in layout design while maintaining manufacturing feasibility through standardized connection structures.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Power grid stubs extend the power distribution network into the vertical dimension by utilizing via-connectors to connect different metal layers. This multi-layer approach increases layout flexibility by allowing power connections in the vertical direction, enabling more efficient routing and potentially reducing cell size without increasing planar manufacturing complexity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Ease of operation

If power grid stubs are used to increase vertical conducting lines, then intra-cell routing flexibility improves, but design and manufacturing specifications become stricter

Engineering Contradiction:
Improveintra-cell routing flexibilityVSAvoiddesign and manufacturing specifications
Core Design Contradiction:
Ease of operationVSManufacturing precision

Solution Approach 1:

Power grid stubs provide localized vertical conducting lines at specific positions within the circuit cell, rather than requiring uniform vertical routing throughout. This allows intra-cell routing flexibility to be enhanced precisely where needed, while maintaining simpler manufacturing specifications in other areas of the layout.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

Via-connectors serve as intermediary elements that bridge the horizontal power grid lines and vertical conducting lines. This intermediary structure simplifies the manufacturing process by using standardized via connections rather than requiring complex direct intersections, thereby improving ease of operation without excessively tightening manufacturing precision requirements.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS12585854B2Circuit cells having power grid stubs
Publication Date: 2026.03.24 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US12585854B2 patent drawing
  • US12585854B2 patent drawing
  • US12585854B2 patent drawing

AI summary

An integrated circuit includes a first power rail and a second power rail extending in a first direction, and a first power grid stub connected to the first power rail through a first via-connector. The integrated circuit also includes a first vertical conducting line extending in a second direction in a circuit cell between a first vertical cell boundary and a second vertical cell boundary. The first vertical conducting line and the first power grid stub are in a same metal layer and aligned with each other along the second direction.