Power Inductor Anti-Plating Layer for Plating Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Power inductors face reliability degradation due to the spreading of plating solutions during the plating operation for forming external electrodes, which affects their manufacturing process and yield.
Innovation Solution
A power inductor design that includes a substrate with through holes, internal coil patterns, a magnetic body, external electrodes, and an anti-plating layer formed from an organic-inorganic hybrid composite, which prevents plating solution spreading by covering the magnetic body between the electrodes, using a substrate with insulating or magnetic materials and metal-polymer composites, and forming cured conductive paste layers with silver and plating layers of nickel or tin.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a plating operation is performed to form external electrodes on the magnetic body, then the electrical connectivity and solderability are improved, but the plating solution spreads uncontrollably causing manufacturing defects and reliability degradation
Solution Approach 1:
An anti-plating layer is formed on the magnetic body surface before the plating operation to prevent plating solution spreading. This preliminary protective layer ensures that subsequent plating processes occur only in designated areas, eliminating manufacturing defects and reliability issues caused by uncontrolled plating solution expansion.
Solution Approach 2:
The anti-plating layer acts as an intermediary between the magnetic body and the plating solution. This intermediate layer controls the interaction between the plating solution and magnetic body, preventing harmful spreading while allowing controlled plating in specific regions, thus resolving the contradiction between reliability improvement and manufacturing precision.
2Area of stationary object
If the magnetic body surface is fully exposed for plating, then complete electrode coverage is achieved, but plating solution spreads to unwanted areas causing defects
Solution Approach 1:
The anti-plating layer is applied selectively to specific regions of the magnetic body surface, creating local differences in plating receptivity. This allows complete electrode coverage in designated areas while preventing plating solution spreading to unwanted regions, resolving the contradiction between coverage area and manufacturing precision.
3Productivity
If no protective layer is used during plating, then the manufacturing process is simple and fast, but plating solution spreads causing reliability degradation
Solution Approach 1:
The anti-plating layer is formed as a preliminary step before plating, preventing future reliability issues. This single preliminary action eliminates the need for complex post-plating corrections and rework, ultimately improving manufacturing efficiency while ensuring product reliability.
Solution Approach 2:
The anti-plating layer, which initially appears to add process complexity, actually converts the potential harm of plating solution spreading into a benefit by enabling precise, controlled plating. This results in higher yield rates and improved reliability without significantly impacting overall productivity.
Data Source
AI summary
A power inductor includes a substrate having a through hole in a central portion thereof; a first internal coil pattern and a second internal coil pattern each having a spiral shape and provided on opposite surfaces of the substrate outwardly of the through hole; a magnetic body enclosing the substrate on which the first internal coil pattern and the second internal coil pattern are provided, end portions of the first internal coil pattern and the second internal coil pattern being exposed to opposite end surfaces thereof; a first external electrode and a second external electrode provided on the opposite end surfaces of the magnetic body to be connected to the end portions of the first internal coil pattern and the second internal coil pattern, respectively; and an anti-plating layer covering the magnetic body between the first external electrode and the second external electrode.