Power Inverter Module With Reduced Parasitic Inductance
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Solution Overview
Problem
Power inverter modules for electric and hybrid vehicles face challenges in achieving high power density while reducing parasitic inductance, which is essential for efficient high-voltage DC-to-AC power conversion.
Innovation Solution
The power inverter module is designed with a configuration that includes multiple conductive layers, terminals with specific material compositions and geometries, and a housing assembly to minimize parasitic inductance, allowing for high switching frequency and efficient power conversion. This configuration involves laser-welding, insulation layers, and a flexible circuit layout to connect semiconductor devices effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional power inverter module design is used, then packaging requirements can be met, but parasitic inductance is high
Solution Approach 1:
The patent transitions from a conventional planar PCB layout to a three-dimensional stacked module architecture with multiple conductive layers (first, second, and third conductive layers) connected through vertical vias. This dimensional change allows current paths to be optimized in the vertical direction, significantly reducing parasitic inductance while maintaining a compact footprint that meets packaging requirements.
Solution Approach 2:
The module is segmented into distinct functional layers with separate conductive paths for different current loops. The first conductive layer handles specific current paths while the second and third layers handle others, with isolation sheets separating critical high-voltage regions. This segmentation allows independent optimization of each current loop's inductance without affecting the entire module.
2Power
If high power density is achieved, then compact design is possible, but parasitic inductance increases
Solution Approach 1:
Multiple current-carrying conductors are merged into a single integrated stacked module structure. The first, second, and third conductive layers are vertically integrated with controlled impedance connections through vias, creating unified current paths that minimize loop areas. This merging achieves high power density in a compact form while the optimized vertical interconnections reduce parasitic inductance compared to separate discrete components.
Solution Approach 2:
The patent changes the geometric parameters of the current paths by using thin-film conductive layers with precisely controlled thickness and trace widths. The conductive traces are optimized to have minimal width and length in critical sections, and the vertical via connections are designed with minimal inductance. These parameter changes enable high power density while maintaining low parasitic inductance.
3Speed
If fast switching control is implemented, then high switching frequency operation is achieved, but parasitic inductance causes voltage spikes
Solution Approach 1:
The patent converts the potentially harmful effect of fast switching into a benefit by designing the stacked module with extremely low parasitic inductance current paths. The vertical conductive layers and optimized trace routing minimize the L di/dt voltage spikes that normally occur during fast switching. The low inductance structure allows high switching frequencies to be achieved without excessive voltage overshoot, turning the fast switching requirement into an opportunity to showcase the module's low-inductance design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables reduced parasitic inductance, allowing for fast switching control of semiconductor devices, improved thermal performance, and compact design, enhancing the efficiency and integration of power inverter modules in electric and hybrid vehicles.
Implementation Method 1
The first terminal may be laser-welded to the first conductive layer at the respective proximal portion and the second terminal may be laser-welded to the second conductive layer at the respective proximal portion
Data Source
AI summary
A power inverter module includes a base module having a plurality of electrically conductive layers, including a first conductive layer, a second conductive layer and a third conductive layer. A first terminal is operatively connected to the first conductive layer at a first end and a second terminal is operatively connected to the second conductive layer at the first end. An isolation sheet is sandwiched between the first and second terminals. The first terminal and the second terminal include a respective proximal portion composed of a first material and a respective distal portion composed of a second material. At least one of the first terminal and the second terminal is bent to create an overlap zone such that a gap between the first terminal and the second terminal in the overlap zone is less than a threshold distance. The power inverter module is configured to reduce parasitic inductance.