Power-Load Thermal Control for Smoother Electronic Cooling
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Solution Overview
Problem
Existing cooling systems for electronic devices often rely on a single thermal setpoint, which can lead to frequent fan operation, noise, reduced processing capability, and shortened device lifespan due to sudden changes in cooling system performance, especially during varying power loads and thermal transients.
Innovation Solution
Implementing a variable thermal setpoint system that filters power load measurements to smooth fan speed adjustments and incorporates a setpoint-independent term in PID control algorithms, allowing for faster responses at higher temperatures and slower responses at lower temperatures, thereby reducing noise and extending device lifespan.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a single thermal setpoint is used for cooling control, then the cooling system can maintain a consistent temperature threshold, but it causes frequent fan operation, noise, and reduced device lifespan due to sudden changes in cooling performance during power load variations
Solution Approach 1:
The patent applies dynamics by transitioning from a fixed thermal setpoint to a dynamic, variable thermal setpoint that adapts to changing power load conditions. The controller adjusts the thermal setpoint based on measured power load and filtered power load values, allowing the cooling system to respond appropriately to varying thermal conditions without causing sudden fan speed changes that would reduce device lifespan
Solution Approach 2:
The patent changes the thermal setpoint parameter dynamically based on power load conditions. By computing a variable thermal setpoint that incorporates both current temperature and filtered power load measurements, the system optimizes cooling performance across different operating conditions while avoiding the harmful effects of a fixed setpoint during transient power variations
2Measurement precision
If the cooling system responds rapidly to power load changes, then temperature control precision is improved, but it causes thermal overshoot and sudden fan speed changes that generate noise
Solution Approach 1:
The patent applies preliminary action by implementing a filter that processes power load measurements before they are used to adjust cooling. The filtered power load value anticipates the thermal impact of power changes, allowing the controller to prepare appropriate cooling responses in advance, thereby avoiding sudden fan speed changes and thermal overshoot that generate noise
Solution Approach 2:
The patent introduces an intermediary filtering mechanism between the raw power load measurement and the cooling control action. This filter smooths out rapid power load variations, providing a more stable basis for thermal setpoint calculation and preventing excessive fan speed adjustments that would create noise
3Stability of the object's composition
If the cooling system maintains high cooling performance at all times, then temperature stability is improved, but it reduces processing capability and increases noise due to constant fan operation
Solution Approach 1:
The patent applies partial action by providing cooling performance that is proportional to the actual thermal needs of the device. Rather than maintaining maximum cooling performance continuously, the system adjusts the thermal setpoint and cooling response to match the current power load, providing sufficient cooling only when necessary and allowing higher processing capability when thermal conditions permit
Data Source
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AI summary
Examples are disclosed that relate cooling an electronic device based on power load. One disclosed example includes a controller configured to obtain a first measure of a power load, apply a filter to obtain a first filtered power load value, set a first thermal setpoint based at least on the first filtered power load value, determine a first temperature of the device, and adjust a response of the cooling mechanism based at least on the first thermal setpoint. The controller is further configured to obtain a second measure of the power load at a different time, apply the filter to obtain a second filtered power load value, set a second thermal setpoint based at least on the second filtered power load value, determine a second temperature of the device, and adjust the response of the cooling mechanism based at least on the second thermal setpoint.