Semiconductor Package Conductive Mix for Power-Matched Heat Dissipation
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Solution Overview
Problem
Semiconductor packages face challenges in heat dissipation due to the use of low thermal conductivity materials, which can lead to heat being trapped in chips, especially as they generate heat during operation, affecting their reliability.
Innovation Solution
A semiconductor package structure incorporating multiple types of conductive components, including solder balls with copper cores for higher thermal conductivity and solder balls made of materials like tin, strategically arranged to enhance heat dissipation based on the power consumption of different electronic components, along with interconnects that optimize thermal and electrical conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If larger solder balls are used, then heat transfer capability is improved, but substrate area occupied increases
Solution Approach 1:
The patent applies local quality by using different solder ball sizes in different regions of the substrate. High-power components are connected to larger solder balls for better heat dissipation, while low-power components use smaller solder balls to save space. This regional differentiation resolves the contradiction between heat transfer capability and substrate area occupation.
Solution Approach 2:
The patent uses composite solder ball structures with copper cores and solder material coatings. The copper core provides high thermal conductivity for heat dissipation, while the solder coating ensures proper bonding. This composite structure improves heat transfer capability without requiring proportionally larger overall size, thus addressing the area occupation issue.
2Ease of manufacture
If uniform solder balls are used for all components, then manufacturing simplicity is maintained, but heat dissipation efficiency decreases
Solution Approach 1:
The patent implements local quality by categorizing components into different power consumption levels and assigning appropriate solder ball sizes to each category. High-power components receive larger solder balls for enhanced heat dissipation, while low-power components use smaller solder balls. This targeted approach improves overall heat dissipation efficiency while maintaining reasonable manufacturing complexity through systematic classification.
3Area of stationary object
If smaller solder balls are used, then substrate area occupied is reduced, but heat transfer capability decreases
Solution Approach 1:
The patent employs composite solder balls with copper cores that provide superior thermal conductivity compared to traditional solid solder balls. This allows the use of smaller overall solder ball sizes while maintaining or improving heat transfer capability, thus reducing substrate area occupation without sacrificing thermal performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly improves heat dissipation efficiency, reducing the risk of failures caused by accumulated heat and ensuring better thermal management for semiconductor packages with varying power consumption requirements.
Implementation Method 1
a thermal conductivity of the first-type conductive components is higher than that of the second-type conductive components
Data Source
AI summary
A semiconductor package comprises: a package substrate having a front surface and a rear surface, wherein the package substrate comprises: a plurality sets of front conductive patterns formed on the front surface; and a plurality sets of interconnects electrically coupled to the plurality sets of front conductive patterns, respectively; a plurality of electronic components mounted to the front surface of the package substrate and electrically coupled to the plurality sets of front conductive patterns via a plurality sets of front conductive components, respectively; wherein the plurality sets of conductive components at least comprise a set of first-type conductive components and a set of second-type conductive components, wherein the set of first-type conductive components are connected to a first electronic component of the plurality of electronic components, and the set of second-type conductive components are connected to a second electronic component of the plurality of electronic components; and wherein a thermal conductivity of the first-type conductive components is higher than the second-type conductive components, and a power consumption of the first electronic component is higher than the second electronic component.