Power Mesh Modification for Semiconductor Chip Power Distribution

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Semiconductor chips with high transistor density often experience power-weak regions where insufficient power is supplied, leading to repeated floor-planning and increased manufacturing costs.

Innovation Solution

A method to modify power meshes by measuring distances between end cap blocks, searching for logic circuit blocks with insufficient power supply or ground voltage lines, and supplementing these lines in the power mesh data to ensure adequate power distribution across the chip.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If the number of transistors or circuits is increased in a relatively small region, then the transistor density is improved, but power-weak regions are generated where sufficient power is not supplied

Engineering Contradiction:
Improvenumber of transistors or circuitsVSAvoidpower supply sufficiency
Core Design Contradiction:
Quantity of substanceVSReliability

Solution Approach 1:

The patent performs preliminary analysis of power distribution by calculating power mesh values at multiple grid points before finalizing the floor plan. This preliminary action identifies potential power-weak regions in advance, allowing the power mesh to be optimized proactively rather than reactively after power issues are discovered.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent changes the parameter of power mesh configuration by adjusting the density and distribution of power supply lines based on calculated power mesh values. When power-weak regions are identified, the power mesh is modified by adding or redistributing power supply lines to achieve adequate power distribution throughout the chip.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If floor-planning is repeated or power increasing work is performed to address power-weak regions, then power supply sufficiency is improved, but manpower, time and manufacturing expenses increase

Engineering Contradiction:
Improvepower supply sufficiencyVSAvoidtime for repeated floor-planning
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The patent performs preliminary analysis of power distribution by calculating power mesh values at multiple grid points before finalizing the floor plan. This preliminary action identifies potential power-weak regions in advance, allowing the power mesh to be optimized proactively rather than reactively after power issues are discovered.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent implements a feedback mechanism where power mesh values are calculated and analyzed to guide floor-planning decisions. The calculated power mesh values provide feedback about power distribution characteristics, enabling iterative optimization of the floor plan to achieve adequate power supply without unnecessary repetitions.

Inventive Principle:
Principle #23Feedback

3Reliability

If power mesh is optimized by adding power supply lines, then power supply sufficiency is improved, but device complexity increases

Engineering Contradiction:
Improvepower supply sufficiencyVSAvoidpower mesh structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent changes the parameter of power mesh configuration by adjusting the density and distribution of power supply lines based on calculated power mesh values. When power-weak regions are identified, the power mesh is modified by adding or redistributing power supply lines to achieve adequate power distribution throughout the chip.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent applies local quality by concentrating additional power supply lines specifically in power-weak regions identified through power mesh analysis, rather than uniformly increasing power mesh density across the entire chip. This targeted approach improves power supply sufficiency where needed while minimizing overall device complexity.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS10379600B2Method of modifying a power mesh
Publication Date: 2019.08.13 SAMSUNG ELECTRONICS CO LTD
  • US10379600B2 patent drawing
  • US10379600B2 patent drawing
  • US10379600B2 patent drawing

AI summary

A method of modifying a power mesh includes measuring distances between end cap blocks included in a standard cell in a chip sub-block. The end cap blocks are located at edges of the chip sub-block and edges of the macro cell. The method includes searching a logic circuit block located between the first and second end cap blocks of the end cap blocks. A distance between the first and second end cap blocks is shorter than a predetermined length. It is determined whether a power supply voltage line and a ground voltage line exist at a partial region of the first power mesh layer. When the power supply voltage line or the ground voltage line is determined not to exist at the partial region, the power mesh data are modified to supplement the power supply voltage line or the ground voltage line at the partial region.