Power Module Aligning Holes for Molding Positioning
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Solution Overview
Problem
Conventional power modules face challenges in minimizing size while preventing damage to insulating substrates during molding, as the heat plate is made smaller than the insulating substrate, leading to potential cracking or breakage when exposed to the molding die.
Innovation Solution
A power module design featuring a multilayer substrate body with aligning holes that allow precise positioning within the molding die, preventing substrate damage and enabling minimization of the module size by ensuring stable placement and secure alignment during resin sealing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the heat plate is made areally smaller than the insulating substrate to minimize product size, then the power module size is reduced, but the insulating substrate becomes vulnerable to shock and may crack or break during molding
Solution Approach 1:
The patent divides the alignment function into separate components: aligning holes are formed in the insulating substrate, and aligning pins are provided in the molding die. This segmentation allows the insulating substrate to be precisely positioned without requiring it to bear the full mechanical load of the molding process, reducing stress and preventing cracking while maintaining compact dimensions.
Solution Approach 2:
The aligning pins act as intermediary elements between the molding die and the insulating substrate. These pins transmit positioning forces through the aligning holes rather than directly applying shock to the insulating substrate, thereby protecting it from damage during the molding process while enabling precise alignment for compact design.
2Manufacturing precision
If aligning holes are formed in the insulating substrate to enable precise positioning, then positioning accuracy is improved, but the insulating substrate structure becomes more complex
Solution Approach 1:
The patent applies local quality by forming aligning holes only in specific regions of the insulating substrate where positioning is required, rather than modifying the entire substrate structure. This localized modification maintains the overall simplicity of the substrate while achieving precise positioning functionality where needed.
Solution Approach 2:
The aligning holes are pre-formed in the insulating substrate before the molding process. This preliminary action ensures that the substrate is ready for precise alignment with the molding die, improving positioning accuracy without requiring complex real-time adjustments during manufacturing.
3Volume of moving object
If the heat plate is made smaller to reduce insulating distance requirements, then product miniaturization is achieved, but the insulating distance between external connecting terminals and heat plate becomes insufficient
Solution Approach 1:
The patent transitions from two-dimensional planar insulation to three-dimensional spatial insulation by having the heat plate protrude in the vertical direction from the molding resin layer. This dimensional change allows the heat plate to be areally smaller while maintaining adequate insulating distance through vertical separation, enabling product miniaturization without compromising insulation.
Solution Approach 2:
Instead of enlarging the heat plate area to ensure insulating distance, the patent inverts the approach by making the heat plate protrude vertically upward from the molding resin layer. This inversion allows the heat plate to be areally smaller while the vertical protrusion provides the necessary insulating distance, achieving miniaturization while maintaining insulation requirements.
Data Source
AI summary
A power module can prevent damages due to cracking or breakage of an insulating substrate when molding even if a heat plate constituting a power module pre-product is made areally smaller than the insulating substrate, and can also sufficiently satisfy demand for minimization. Specifically, the power module pre-product is sealed by a molding resin layer in a state where externally exposed end portion on one end side in both external connecting terminals and the other surface side of a heat plate are each exposed to the outside. The power module substrate constituting a multilayer substrate body includes an aligning hole, into which an aligning pin is inserted, the pin being included in a lower molding die constituting a molding die with an upper molding die that molds a molding resin layer, so as to position the power module pre-product inside a cavity.