Power Module Alternate Recesses for Fin Flopping

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Solution Overview

Problem

Conventional power modules experience fin flopping and associated stress issues when attaching fins, which can damage the package.

Innovation Solution

A power module design featuring first and second recesses on side faces of the package, arranged alternately, to reduce fin flopping and distribute stress, with no protruding power or control terminals to prevent insulation issues and allow for improved heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If two recesses are symmetrically arranged on a center line in a transverse or longitudinal direction of the package, then the fin attachment structure is simple and symmetric, but the fin flops and stress caused by the flopping damages the package

Engineering Contradiction:
Improvesymmetrical recess arrangementVSAvoidpackage damage from fin flopping
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent applies asymmetry by arranging the first and second recesses not at positions opposite to each other on the center line, but alternately on side faces of the package. This asymmetric arrangement prevents the fin from flopping symmetrically, thereby distributing stress and preventing package damage while maintaining manufacturing simplicity.

Inventive Principle:
Principle #4Asymmetry

2Temperature

If recesses are provided on side faces of the package, then fin attachment and heat dissipation are improved, but terminal protrusion issues may arise

Engineering Contradiction:
Improveheat dissipationVSAvoidterminal arrangement complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent applies local quality by providing recesses on specific side faces of the package where neither power terminals nor control terminals protrude. This localized arrangement enables fin attachment for improved heat dissipation while avoiding interference with terminal functions, thus resolving the contradiction between heat dissipation improvement and device complexity.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS10796979B2Power module
Publication Date: 2020.10.06 MITSUBISHI ELECTRIC CORP
  • US10796979B2 patent drawing
  • US10796979B2 patent drawing
  • US10796979B2 patent drawing

AI summary

A power module includes: a power chip; a control chip controlling the power chip; a power terminal connected to the power chip; a control terminal connected to the control chip; and a package covering the power chip, the control chip, the power terminal, and the control terminal with mold resin, wherein first and second recesses for attaching a fin are respectively provided on side faces facing each other of the package from which neither the power terminal nor the control terminal protrudes, and the first and second recesses are arranged not at positions opposite to each other but alternately.