Grooved Power Module Housing for Arc Containment and Heat Dissipation
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Solution Overview
Problem
Power modules in power converters suffer from poor sealing performance and are prone to damage due to insufficient heat dissipation and breakdowns, which are not adequately protected against arc damage.
Innovation Solution
A power module design featuring a housing with a groove accommodating a circuit component, a fastening layer on the groove bottom, and a heat sink, along with a pin extending outwards, is used to enhance sealing, heat dissipation, and control arc direction during breakdowns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a power module uses conventional packaging material, then the manufacturing process is simple, but the sealing performance is poor and arc damage cannot be shielded
Solution Approach 1:
The housing is divided into a main housing and a groove structure, where the groove is specifically designed to contain arcs. This segmentation allows the housing to perform multiple functions: general protection from the main housing and arc containment from the groove structure, thereby improving sealing performance without requiring a completely new housing design.
Solution Approach 2:
The groove structure is nested within the housing, creating a contained space for arc propagation. This nested design allows the arc-containing groove to be integrated into the existing housing structure, improving sealing and arc shielding while maintaining overall structural compactness and avoiding excessive complexity.
2Reliability
If the circuit component is exposed without accommodation, then the structure is simple, but protection strength is insufficient
Solution Approach 1:
The groove structure is pre-designed and integrated into the housing before the power module assembly is completed. This preliminary action ensures that the circuit component will be protected within the groove structure from the outset, providing adequate protection strength without requiring additional protective measures later in the manufacturing process.
3Object-affected harmful factors
If breakdown occurs without arc containment, then the structure is simple, but fault damage is extensive
Solution Approach 1:
The groove structure is designed to contain and redirect arc damage caused by breakdown. Instead of allowing arcs to propagate freely and cause extensive damage to surrounding electronic devices, the groove confines the arcs within a specific space, converting the harmful arc energy into a contained phenomenon that causes minimal damage. This approach transforms the potential harm of breakdown into a controlled event.
4Reliability
If the pin does not extend out of the housing, then the structure is compact, but connection reliability is reduced
Solution Approach 1:
The pin extends partially out of the housing, just enough to ensure reliable connection with external devices. This partial extension provides adequate connection reliability without excessive pin length that would increase the overall size of the power module. The pin length is optimized to achieve the necessary connection function while maintaining compact dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves protection and reduces fault damage by containing arcs within the groove, ensuring reliable connection and efficient heat dissipation, thereby enhancing the power module's reliability and reducing overall damage.
Implementation Method 1
improve heat conduction efficiency of the circuit component
Implementation Method 2
heat sink is located on a side away from an orientation of the groove opening
Implementation Method 3
heat sink is located on a side away from an orientation of the groove opening
Implementation Method 4
the heat dissipation surface is fastened to the fastening layer through welding
Implementation Method 5
the fastening layer is formed on the bottom surface of the groove through electroplating
Data Source
AI summary
A power module includes a housing, a circuit component, and a package. The housing includes a main housing, a heat sink, and a fastening layer. A first outer surface of the main housing is provided with a groove. The fastening layer is disposed on a bottom surface of the groove. The heat sink is located on a side opposite to an orientation of the groove. The circuit component includes a heat dissipation surface and a pin. The heat dissipation surface is fastened to the fastening layer through welding. The pin extends out of the first outer surface in a direction away from the fastening layer. The package is configured to cover the circuit component, and to at least partially expose a distal end of the pin.