Power Module Equipotential Bonding via Metallic Base Plate
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Solution Overview
Problem
Existing power module designs are complex and difficult to produce, requiring separate cables for equipotential bonding and inefficient heat dissipation, leading to potential thermal issues.
Innovation Solution
A power module with a metallic base plate and insulating layer, featuring integrated equipotential bonding through a capacitive interference suppression unit and direct connection to a heat sink, allowing for efficient heat dissipation and simplified production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate cables are used for equipotential bonding, then potential equalization can be achieved, but device complexity and production difficulty increase
Solution Approach 1:
The patent combines the equipotential bonding function with the power module structure itself. The metallic base plate serves dual purposes: as a structural component and as the equipotential bonding connection. This eliminates the need for separate bonding cables and reduces production complexity while maintaining reliable potential equalization.
Solution Approach 2:
The metallic base plate is designed to perform multiple functions simultaneously: it provides mechanical support, enables heat dissipation, and establishes equipotential bonding. This multi-functionality reduces the overall number of components needed and simplifies the assembly process.
2Reliability
If separate bonding cables are used, then potential equalization is achieved, but the loop area and inductance increase
Solution Approach 1:
By integrating the bonding connection directly into the power module's metallic base plate, the patent minimizes the distance between the semiconductor switching elements and the bonding point. This eliminates long external cables and reduces the current loop area and associated inductance, thereby improving electromagnetic compatibility.
3Reliability
If complex production processes are used for equipotential bonding, then reliable connection is achieved, but manufacturing time and cost increase
Solution Approach 1:
The equipotential bonding connection is built into the power module structure during manufacturing. The metallic base plate is directly connected to the semiconductor elements through integrated connection technologies, eliminating the need for separate bonding cable assembly steps and simplifying the overall production process.
4Temperature
If heat dissipation is not optimized, then thermal management is difficult, but peak temperatures increase
Solution Approach 1:
The metallic base plate is designed to serve as both a structural component and a heat dissipation pathway. It provides direct thermal coupling between the semiconductor switching elements and the heat sink, enabling efficient heat transfer while maintaining mechanical support and equipotential bonding functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables straightforward production, minimal loop area for potential equalization, efficient heat dissipation, and reliable thermal management, preventing peak temperatures and ensuring device safety.
Implementation Method 1
power semiconductors generate heat that can be dissipated by means of a heat sink
Implementation Method 2
the power module having a capacitive interference current short-circuiting interference suppression unit
Data Source
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AI summary
An electronic arrangement with power module, circuit board and cooling body, wherein the power module has a metallic base plate, wherein an insulation layer is arranged on that side of the base plate which faces toward the circuit board, wherein metallic conductor tracks, composed in particular of copper, are arranged on that side of the insulation layer which is averted from the base plate, wherein semiconductors are arranged on the conductor tracks, in particular on that side of the conductor tracks which is respectively averted from the insulation layer, wherein the base plate is connectable directly, or by means of an interlayer connection, to a terminal contact which functions as an equipotential bond to the circuit board.