Power Module Baseplate Protrusions to Prevent Package Delamination
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing power module packaging technologies face issues of delamination and cracking between the package baseplate and the plastic package body, leading to inadequate protection of the semiconductor chip and potential failure of the power module.
Innovation Solution
The power module design includes a chip, a package baseplate, a ceramic baseplate, and a plastic package body, where the package baseplate features protrusion structures on its surface close to the ceramic baseplate, ensuring increased bonding force with the plastic package body to prevent delamination and cracking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the bonding force between package baseplate and plastic package body is insufficient, then the structure is simpler, but delamination and cracking occur between the package baseplate and plastic package body
Solution Approach 1:
The protrusion structures are pre-formed on the package baseplate before the plastic package body is molded. These protrusions extend into the plastic package body to create mechanical interlocking, ensuring strong bonding force is achieved before any delamination or cracking can occur during operation.
Solution Approach 2:
Instead of uniformly increasing the bonding surface area across the entire package baseplate, protrusion structures are strategically placed at specific locations where bonding is most critical. This localized approach enhances bonding force while minimizing additional structural complexity.
2Strength
If protrusion structures are added to the package baseplate, then bonding force increases, but manufacturing complexity increases
Solution Approach 1:
The protrusion structures are integrated directly into the package baseplate as a single component rather than being added as separate parts. This merging of features into one piece reduces the number of manufacturing steps and assembly operations, thereby improving ease of manufacture while still achieving enhanced bonding force.
3Area of stationary object
If the area of package baseplate is greater than ceramic baseplate, then bonding surface area increases, but the risk of delamination in uncovered areas increases
Solution Approach 1:
Protrusion structures are pre-positioned specifically in the regions of the package baseplate that extend beyond the ceramic baseplate boundaries. This preliminary placement ensures that the additional area, which is most susceptible to delamination, receives enhanced bonding reinforcement through the protrusions embedded in the plastic package body.
Data Source
Figure 1~3
Figure 4(a)~5(b)
Figure 6(a)~7(b)
AI summary
This application provides a power module, including: a chip, a package baseplate, a ceramic baseplate, and a plastic package body. The chip is disposed on the ceramic baseplate, the package baseplate is disposed on a surface that is of the ceramic baseplate and that is away from the chip, and an area of the package baseplate is greater than an area of the ceramic baseplate. The package baseplate includes at least one protrusion structure, the at least one protrusion structure is located on a surface that is of the package baseplate and that is close to the ceramic baseplate, and projection of the at least one protrusion structure does not overlap projection of the ceramic baseplate in a thickness direction of the chip. The chip, the ceramic baseplate, and the surface that is of the package baseplate and on which the at least one protrusion structure is disposed are disposed in the plastic package body. Based on the foregoing technical solutions, problems of delamination and cracking between the package baseplate and the plastic package body can be resolved.