Power Module Heat Sink Crimp Joint With Buffer Recess Alignment
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Solution Overview
Problem
Heat-sink-integrated power semiconductor modules face challenges in increasing productivity during the integration of power module parts and heat sinks, requiring improved manufacturing methods to reduce load and enhance alignment precision.
Innovation Solution
The integration of a power semiconductor device involves forming uneven parts on both the module base and heat sink base with buffer recesses that extend in perpendicular directions, allowing for a crimping process that reduces the press load required for assembly and increases productivity by accommodating misalignment and providing an anchor effect.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the module base and heat sink base part are joined together with tight fitting uneven parts, then the holding strength is improved, but the misalignment between parts increases and manufacturing precision deteriorates
Solution Approach 1:
The buffer recess is designed in advance to accommodate potential misalignment between the module base and heat sink base part during assembly. This recess acts as a cushioning space that absorbs positioning errors, allowing the uneven parts to fit together while maintaining both holding strength and alignment tolerance.
Solution Approach 2:
The invention changes the geometric parameters of the uneven parts by incorporating a buffer recess with specific dimensions (extending in a direction crossing the fitting direction). This parameter modification allows the joint structure to accommodate misalignment while maintaining sufficient holding strength through the fitted uneven parts.
2Reliability
If the press load is increased to ensure proper joining of module base and heat sink, then the joining reliability is improved, but the manufacturing complexity and equipment requirements increase
Solution Approach 1:
The buffer recess provides a predetermined cushioning space that compensates for assembly variations, ensuring reliable joining without requiring excessive press load. This design built into the structure beforehand maintains joining reliability while avoiding the need for complex high-load equipment.
3Strength
If the uneven parts are designed to fit tightly for maximum holding strength, then the anchor effect is improved, but the assembly difficulty increases due to alignment requirements
Solution Approach 1:
The buffer recess is designed in advance to accommodate potential misalignment during assembly operations. This cushioning space allows workers or automated systems to assemble the components more easily by absorbing positioning errors, while the surrounding fitted uneven parts still provide the necessary anchor effect for holding strength.
Data Source
AI summary
A power semiconductor device includes a power module part and a heat sink. An uneven part is formed in a module base in the power module part. The uneven part includes a recess and a buffer recess. The buffer recess is formed in a direction that crosses a direction in which the recess extends. An uneven part is formed on a heat sink base part in the heat sink. The uneven part and the uneven part are fitted together by a crimping process to integrate the module base of the power module part and a heat radiation diffusion part of the heat sink. The buffer recess is left as a space.