Vehicle Power Module Busbar Cooling Without Ceramic Insulation

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Solution Overview

Problem

Existing power electronics in vehicles face high thermal resistance and heat flow densities due to the use of ceramic layers for insulation, limiting power density and requiring inefficient cooling methods.

Innovation Solution

Implementing a dielectric fluid to replace ceramic layers for insulation, allowing for a compact design with reduced thermal resistance and improved cooling efficiency through plug-in fluid and electrical connections.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If ceramic insulation layers are used to electrically isolate the coolant from current-carrying components, then electrical insulation is achieved, but thermal resistance increases significantly

Engineering Contradiction:
Improveelectrical insulationVSAvoidthermal resistance
Core Design Contradiction:
ReliabilityVSTemperature

Solution Approach 1:

The patent removes the ceramic insulation layer from the thermal path between power semiconductors and coolant. By extracting this high thermal resistance component, the invention achieves direct liquid cooling contact while maintaining electrical insulation through alternative means (electrically insulating busbar design), thereby significantly reducing thermal resistance and improving heat dissipation efficiency

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The invention changes the thermal conductivity parameter of the insulation path by replacing ceramic material (low thermal conductivity) with direct liquid contact (high thermal conductivity). This parameter change transforms the thermal resistance characteristic while maintaining electrical insulation through the busbar design, resolving the contradiction between insulation reliability and thermal management

Inventive Principle:
Principle #35Parameter changes

2Reliability

If ceramic insulation layers are used for electrical isolation, then galvanic isolation is achieved, but the power module size increases

Engineering Contradiction:
Improvegalvanic isolationVSAvoidpower module size
Core Design Contradiction:
ReliabilityVSVolume of stationary object

Solution Approach 1:

The patent extracts the ceramic insulation layer from the power module structure, removing the volume-consuming component that provided galvanic isolation. The function of electrical isolation is then achieved through the electrically insulating busbar design, which maintains galvanic isolation while occupying minimal space, thereby reducing overall module size

Inventive Principle:
Principle #2Taking out (Extraction)

3Reliability

If ceramic insulation layers are used, then electrical insulation is maintained, but manufacturing costs increase

Engineering Contradiction:
Improveelectrical insulationVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The invention removes the ceramic insulation layer, eliminating the need for complex ceramic processing, assembly, and alignment operations. The electrical insulation function is integrated into the busbar design, which can be manufactured using standard metalworking techniques, thereby simplifying the manufacturing process and reducing costs

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The invention merges the electrical insulation function with the busbar structure by designing the busbar to provide both current conduction and electrical isolation. This functional integration eliminates the need for separate ceramic insulation components and their associated manufacturing steps, reducing overall manufacturing complexity and cost

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Achieves a 50% reduction in thermal resistance, enabling higher power density, modular design, and flexible scaling of power modules with efficient cooling using dielectric fluid and air-cooled heat exchangers.

Implementation Method 1

the heat is transferred between the semiconductors to be cooled and the heat-transferring surface (contact surface cooler-coolant) solely by heat conduction

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 2

a dielectric fluid flows through cooling ducts (13, 15, 17) of the DC busbars (12, 14) and phase busbars (16)

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentUS12604442B2Power module, particularly for power electronics of a vehicle
Publication Date: 2026.04.14 ROBERT BOSCH GMBH
  • US12604442B2 patent drawing
  • US12604442B2 patent drawing
  • US12604442B2 patent drawing

AI summary

A power module, for power electronics of a vehicle, having two DC busbars and three phase busbars which are disposed between the two DC busbars, and a plurality of power semiconductors, each of which is disposed between one of the DC busbars and one of the phase busbars, and power electronics having at least one such power module, and a vehicle having such power electronics. The DC busbars and the phase busbars are electrically insulated from one another and in each case have at least one cooling duct through which a dielectric fluid flows, at both open ends each of the DC busbars and the phase busbars having at least one plug-in electrical contact connection and at least one plug-in fluid connection that in each case form a combined plug-in connection, so that multiple power modules are connectable to each other in fluid-tight fashion using plug connections.