Power Module Busbar Design for Space-Constrained EV Converters

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Solution Overview

Problem

Conventional power converters for hybrid or electric vehicles occupy large installation space due to the need for bond connections and mechanical supports for semiconductor components, which limits space for other vehicle components and introduces reliability issues from temperature fluctuations and vibrations.

Innovation Solution

A power module design featuring flat, electrically and thermally conductive busbars that provide direct, flat electrical connections between semiconductor components, eliminating the need for bond connections and reducing installation space by integrating semiconductor components directly onto the busbars, while also enhancing thermal management and reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional bond connections and mechanical supports are used for semiconductor components, then reliable electrical connections are achieved, but the installation space of the power converter increases significantly

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidinstallation space

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

The patent merges the electrical connection function and mechanical support function into a single integrated busbar structure. The busbar directly contacts the semiconductor components to provide electrical connection while its rigid structure provides mechanical support, eliminating the need for separate bond connections and mechanical supports, thus reducing installation space while maintaining connection reliability

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent extracts and eliminates the unnecessary bond connections and separate mechanical supports from the conventional design. By using the busbar alone to perform both electrical connection and mechanical support functions, the redundant components are removed, significantly reducing the installation space of the power converter

Inventive Principle:

Principle #2Taking out (Extraction)

2Ease of operation

If larger installation space is provided for semiconductor components, then easier assembly and maintenance are achieved, but the power converter occupies more space in the vehicle

Engineering Contradiction:

Improveassembly easeVSAvoidvehicle installation space

Core Design Contradiction:

Ease of operationVSArea of stationary object

Solution Approach 1:

The busbar integrates electrical connection and mechanical support functions, simplifying the overall structure. This integration reduces the number of components and assembly steps, making assembly easier while minimizing the space required in the vehicle

Inventive Principle:

Principle #5Merging (Combining)

3Adaptability or versatility

If conventional electrical connections with bond wires are used, then flexible electrical connections are achieved, but parasitic inductance and resistance increase

Engineering Contradiction:

Improveconnection flexibilityVSAvoidparasitic inductance and resistance

Core Design Contradiction:

Adaptability or versatilityVSLoss of energy

Solution Approach 1:

The patent replaces the mechanical bond wire connection system with a direct solid-contact busbar system. This substitution eliminates the long, thin bond wires that create high parasitic inductance and resistance, using instead a rigid busbar with large contact surfaces that provides low-impedance electrical connection while maintaining structural stability

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution reduces the overall installation space required for power converters, improves electrical and thermal characteristics, and enhances reliability by minimizing parasitic inductance and resistance, leading to more efficient power conversion and efficient cooling of semiconductor components.

Implementation Method 1

the first busbar comprises a second region, via which the first busbar can be connected in a thermally conductive, electrically insulating, flat and mechanical manner to a cooling unit

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a first semiconductor component on the first surface of the first busbar, said semiconductor component comprising a first surface with a first electrical surface contact terminal, and being connected in an electrically conductive, flat and mechanical manner via the first surface contact terminal to the first surface of the first busbar

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS10027094B2Power module, power converter and drive arrangement with a power module

Publication Date: 2018.07.17 VITESCO TECH GERMANY GMBH

AI summary

A power module for a power converter includes a first busbar with a first surface and a second surface opposite the first surface, a first semiconductor component on the first surface of the first busbar, which semiconductor component has a first surface with a first electrical surface contact connection and is connected, via the first surface contact connection, to the first surface of the first busbar in an electrically conductive and mechanical fashion over an area, and a second semiconductor component on the second surface of the first busbar, which semiconductor component has a first surface with a first electrical surface contact connection and is connected, via the first surface contact connection of the second semiconductor component, to the second surface of the first busbar in an electrically conductive and mechanical fashion over an area.