Vehicle Power Commutation Module Busbar Layout for PCB Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Power commutation modules for vehicles face challenges due to bulky power transistors that require large printed circuit board surfaces for current support and heat dissipation, leading to increased size and potential electrical delays and heat distribution issues.
Innovation Solution
A motor vehicle power commutation module design featuring a printed circuit board with power switches and busbars arranged such that switch base plates are directly mounted on busbars positioned near the periphery, allowing for reduced board size, optimized heat dissipation, and minimized electrical delays by using busbars for current conduction and cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If power transistors are soldered on the printed circuit board with busbars fixed on the opposite face, then the power transistors can be cooled through plated-through holes, but the printed circuit board requires a large surface area to support bulky transistors and dissipate heat
Solution Approach 1:
The patent transitions from a traditional two-face arrangement (transistors on one face, busbars on the opposite face) to a single-face arrangement where both transistors and busbars are positioned on the same face of the printed circuit board. This dimensional reorganization allows for compact integration and reduces the overall board surface area required while maintaining effective heat dissipation pathways through the plated-through holes.
Solution Approach 2:
The patent merges the positioning of transistors and busbars onto the same face of the printed circuit board, eliminating the need for separate faces. This consolidation allows for optimized spatial arrangement where busbars can be directly positioned near transistors for efficient thermal and electrical connection, reducing the total board area while maintaining cooling effectiveness.
2Power
If bulky power transistors are used to drain strong currents, then the current conduction capability is improved, but the printed circuit board size must be increased to accommodate the transistors and support heat dissipation
Solution Approach 1:
The patent applies local quality by concentrating high-power components (transistors and busbars) in specific localized areas on the same face of the printed circuit board, rather than distributing them across the entire board surface. This allows for high current conduction capability in targeted regions while minimizing the overall board area required, as other regions can be used for control circuitry or left empty.
Solution Approach 2:
By repositioning busbars and transistors to the same face, the patent creates a compact local arrangement that supports high power handling in a concentrated manner, reducing the spread-out area requirement while maintaining strong current conduction through optimized local connections.
3Loss of time
If power transistors are positioned away from the periphery of the printed circuit board, then the layout is simplified, but electrical delays increase and heat dissipation efficiency is reduced
Solution Approach 1:
The patent preliminarily positions the busbars on the same face as the transistors, close to their respective locations, before final assembly. This pre-positioning ensures minimal electrical connection paths and optimal thermal contact through plated-through holes, reducing electrical delays and improving heat dissipation efficiency without requiring complex post-assembly adjustments.
Solution Approach 2:
The patent optimizes the local arrangement of transistors and busbars by placing them close to each other on the same face, creating efficient local connections that minimize electrical path lengths and maximize thermal contact effectiveness, thereby reducing electrical delays while maintaining layout simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces the printed circuit board size, minimizes electrical delays, and optimizes heat dissipation and fixing constraints, enhancing the overall efficiency and reliability of the power commutation module.
Implementation Method 1
The busbars (30, 32) are arranged close to said outer periphery (42, 44) of the printed circuit board (12)... allowing the cooling of the power transistors
Implementation Method 2
The busbars are in contact with the power transistors by means of a plated-through hole, and thus allow the cooling of the power transistors
Data Source
Figure 1
Figure 2
AI summary
A motor vehicle power commutation module (10) comprises a printed circuit board (12), a first plate-shaped busbar (30), a first series of power switches (14, 16, 18, 20) each comprising a series of connection pins (68) which are connected on the upper face (13) of the printed circuit board (12) and a metal base plate (67) which is applied against the busbar (30); the first series of power switches (14, 16, 18, 20) is mounted on the first busbar (30), the power switches (14, 16, 18, 20) being generally aligned along a longitudinal edge (35) of the first busbar (30), in that said longitudinal edge (35) of the first busbar (30) is arranged along a first longitudinal edge (34) of the printed circuit board (12), and the portion (42) of the first busbar (30) on which the power switches (14, 16, 18, 20) are mounted is arranged next to the printed circuit board (12).