Stacked Power Module With Capacitor Assembly Layer for Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge of high current demand in modern GPUs and CPUs requires power converters with higher power density and efficient heat dissipation, as traditional designs face challenges in managing increased current and reduced size.
Innovation Solution
A power module with a stacked structure integrating inductors, power IC dies, input capacitors, and output capacitors, featuring a magnetic core with embedded windings and heat sinks for enhanced heat dissipation, and a 3D stacking of capacitor and die assembly layers for increased power density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If traditional power converter designs are used, then the structure is simpler and easier to manufacture, but the power density is lower and heat dissipation is insufficient
Solution Approach 1:
The patent transitions from a traditional planar layout to a three-dimensional stacked architecture, where capacitor assemblies and die assemblies are arranged in vertical layers. This dimensional change allows multiple functional components to be integrated within a compact footprint, significantly increasing power density while maintaining manageable structural complexity through modular design.
Solution Approach 2:
The patent implements nesting by placing capacitor assemblies within recesses of the stacked structure and embedding windings within magnetic cores. This nested arrangement maximizes space utilization, allowing components to be housed within each other's structural envelopes, thereby increasing power density without proportionally increasing overall device volume.
2Volume of moving object
If the size of power converters is reduced to improve integration density, then the integration density increases, but the heat dissipation capability deteriorates
Solution Approach 1:
The patent divides the power converter into distinct functional segments arranged in separate layers: capacitor assemblies in lower layers, die assemblies in upper layers, and heat sinks positioned to receive heat from specific die assemblies. This segmentation allows heat to be collected and dissipated from localized sources, maintaining effective thermal management despite reduced overall device size.
Solution Approach 2:
The patent introduces heat sinks as intermediary thermal management components between the die assemblies and the external environment. These heat sinks act as thermal mediators, capturing heat from specific die assemblies and facilitating its dissipation, thereby enabling effective heat management in a compact integrated structure.
3Productivity
If higher current is handled to meet processor performance requirements, then the processor performance improves, but the heat generation increases
Solution Approach 1:
The patent converts the harmful effect of heat generation into a beneficial thermal management system. By positioning heat sinks to receive heat from specific die assemblies and arranging capacitor assemblies within thermal zones, the design utilizes the thermal energy that would otherwise be waste, directing it through controlled paths for efficient dissipation, thereby supporting high current operation without excessive temperature rise.
4Area of stationary object
If the converter size is reduced, then the integration density improves, but the heat conduction path becomes more challenging
Solution Approach 1:
The patent resolves heat conduction challenges in compact designs by transitioning to three-dimensional heat flow paths. Heat sinks are positioned to receive heat vertically from die assemblies above, and capacitor assemblies are placed within thermal zones to assist in heat distribution. This vertical heat conduction path in the third dimension bypasses the limitations of planar heat dissipation, enabling effective thermal management in a reduced footprint.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved heat dissipation and increased power density, enhancing the performance of power converters in high-current, low-voltage applications like CPUs and GPUs, while maintaining efficient heat management.
Implementation Method 1
heat sinks for enhanced heat dissipation
Implementation Method 2
heat sinks for enhanced heat dissipation
Implementation Method 3
inductor assembly attached to the upper surface of the second layer, comprising a magnetic core, a first winding passing through the magnetic core, and a second winding passing through the magnetic core
Implementation Method 4
The first plurality of capacitors are electrically connected in parallel between an input node and a reference ground, and the second plurality of capacitors are electrically connected in parallel between an output node and the reference ground
Data Source
AI summary
A power module has a first layer, a second layer, and an inductor assembly. The first layer has a plurality of connecting pillars, a first plurality of capacitors electrically connected in parallel between an input node and a reference ground, and a second plurality of capacitors electrically connected in parallel between an output node and the reference ground. The second layer is attached between the first layer and the inductor assembly, having a first pair of switches forming a first switch node, and a second pair of switches forming a second switch node. The first pair of switches and the second pair of switches are electrically connected between the input node and the reference ground. The inductor assembly has a first inductor electrically connected between the output node and the first switch node and a second inductor electrically connected between the output node and the second switch node.