Power Module Carrier Board Parasitic Inductance Reduction
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Solution Overview
Problem
Modern power electronic equipment faces challenges with high parasitic inductance and electromagnetic interference (EMI) due to high-frequency switching, which affects reliability and efficiency, and requires effective heat dissipation to maintain performance and extend the lifespan of power semiconductor devices.
Innovation Solution
A carrier board with two metal-wiring layers and at least one metal block is used to connect switches in series, forming a bridge arm, which reduces parasitic inductance and EMI by decoupling high-frequency loops and improving heat dissipation through double-sided heat dissipation and thinner metal-wiring layers, while keeping the metal conductive component away from the carrier board trace to minimize output capacitance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If high-frequency switching is used to improve power conversion efficiency, then power conversion efficiency is improved, but parasitic inductance causes voltage spikes and EMI that reduce reliability
Solution Approach 1:
The patent segments the power loop into multiple controlled paths using a multi-layer carrier board structure. The metal-wiring layers are arranged to create separate current paths for different switching phases, reducing the overall parasitic inductance of the power loop while maintaining high-frequency switching capability
Solution Approach 2:
The patent transitions from a planar single-layer layout to a three-dimensional multi-layer carrier board structure. By stacking metal-wiring layers vertically and using vias for inter-layer connections, the patent reduces the area of high-frequency current loops and minimizes parasitic inductance in the Z-direction, enabling faster switching with reduced voltage spikes
2Temperature
If larger metal-wiring layers are used to improve heat dissipation, then heat dissipation is improved, but output capacitance increases leading to higher switching loss
Solution Approach 1:
The patent applies different metal-wiring layer configurations to different regions of the carrier board. Areas with high current density and heat generation (such as near power semiconductor devices) have optimized wiring patterns and thicknesses, while other areas use thinner layers to minimize capacitance. This localized optimization allows effective heat dissipation where needed without unnecessarily increasing output capacitance
Solution Approach 2:
The patent uses composite construction with multiple metal-wiring layers separated by insulating materials. This composite structure provides both thermal management capability through the metal layers and electrical isolation through the insulating materials, reducing parasitic capacitance between layers while maintaining heat dissipation efficiency
3Temperature
If complex heat dissipation systems are added to improve thermal management, then thermal management is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The carrier board performs multiple functions simultaneously: it provides electrical connections through metal-wiring layers, thermal management through the same metal layers acting as heat sinks and heat transfer paths, and mechanical support for power semiconductor devices. This multi-functionality eliminates the need for separate dedicated heat dissipation components, reducing overall system complexity
Solution Approach 2:
The patent merges the electrical connection function and thermal management function into a single integrated carrier board structure. The metal-wiring layers that provide electrical conductivity also serve as thermal conduction paths, combining what would traditionally be separate components into one unified structure, thereby simplifying assembly and reducing manufacturing complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces parasitic inductance and EMI, enhances power density, and improves heat dissipation, leading to increased reliability and reduced manufacturing costs, while simplifying the assembly and manufacturing process of the power module.
Implementation Method 1
Good thermal management is essential to improve the conversion efficiency, power density and reliability of power devices... the heat dissipation system is required to control the temperature of the semiconductor chip within an acceptable range
Implementation Method 2
A carrier board including two metal-wiring layers and at least one metal block is used to connect switches in series... reducing parasitic inductance and EMI by decoupling high-frequency loops
Implementation Method 3
By partially overlapping the projections of the at least two metal-wiring layers, the at least one metal block and the two switches connected to each other in series on the surface of the carrier board, two high frequency loops decoupled from each other are formed
Data Source
AI summary
A power module is disclosed. The power module includes a carrier board, two switches, at least one metal block, a clamping component and a metal conductive component. The carrier board includes an upper surface and a lower surface. The two switches are disposed on the upper surface and connected in series to form a bridge arm electrically connected between a positive terminal and a negative terminal. The metal block is electrically connected to the two switches. The clamping component is disposed on the upper surface and electrically connected in parallel with the bridge arm through the carrier board. The metal conductive component is connected from a common node of the two switches to an output terminal. The metal conductive component is located at a side of the two switches facing away from the upper surface.