Power Module Carrier Assembly Integrating Circuit Board and Lead Frame
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Solution Overview
Problem
Conventional power modules face challenges in operating under high voltage and high current conditions due to inadequate heat dissipation and voltage withstand capabilities.
Innovation Solution
A power module design featuring a carrier assembly with a bottom board, circuit board, lead frame, and pad groups, where the circuit board's extending portions are strategically placed between conductive portions of the lead frame, allowing for improved heat dissipation and increased voltage withstand, and enabling the module to handle high currents through optimized electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If discrete power components are mounted on a printed circuit board, then the power module can be assembled with conventional components, but the heat dissipation capability is insufficient for high power operation
Solution Approach 1:
The patent combines the circuit board and lead frame into a single integrated carrier assembly. The lead frame serves dual functions as both an electrical connection structure and a heat dissipation structure, while the circuit board provides both electrical routing and mechanical support. This merging eliminates the need for separate mounting of discrete components and provides enhanced heat dissipation through the integrated lead frame structure that extends beyond the circuit board boundaries.
2Adaptability or versatility
If a conventional circuit layout is formed on a printed circuit board, then the circuit design can be implemented, but the voltage withstand capability is insufficient for high voltage conditions
Solution Approach 1:
The patent extends the lead frame structure in three-dimensional space beyond the planar circuit board. The lead frame includes extending portions that protrude from the circuit board surface, creating additional spatial dimensions for electrical connections. This dimensional extension increases the creepage and clearance distances between high voltage nodes, thereby enhancing voltage withstand capability while maintaining circuit layout flexibility.
3Power
If discrete power components are mounted on the printed circuit board, then the power module can handle power conversion, but the current handling capability is limited
Solution Approach 1:
The patent segments the electrical connection path into multiple parallel conductive paths through the lead frame structure. The lead frame includes multiple extending portions and conductive sections that can carry current simultaneously, effectively increasing the total current handling capability. This segmentation of the current path allows the power module to handle higher currents than would be possible with a single trace on a conventional circuit board.
Data Source
AI summary
A power module including a carrier assembly and a power device disposed on the carrier assembly is provided. The carrier assembly includes a bottom board, a circuit board, a lead frame, and a pad group. The circuit board is disposed on the bottom board and includes a device mounting portion and an extending portion protruding from a side of the device mounting portion. The lead frame disposed on the bottom board includes a first conductive portion and a second conductive portion insulated from each other. The extending portion of the circuit board is disposed between the first and second conductive portions, and an upper surface of the lead frame is flush with a top surface of the extending portion. A pad group includes a first pad disposed on the extending portion, a second pad and a third pad respectively disposed on the first and second conductive portions.