Power Module Case and Internal Terminal Elastic Connection

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Solution Overview

Problem

Existing power modules are difficult to disassemble, leading to increased costs and inefficiencies in replacing semiconductor devices and their associated components, particularly around heat generation sources, due to integral formation with sealing resin.

Innovation Solution

A power module design featuring a separate case and insulating substrate connected via an elastic member, allowing for easy removal and replacement of the semiconductor device by exposing the internal terminal and using a sealing material that does not form an integral bond with the case, enabling efficient detachment and reattachment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the insulating substrate and case are integrally formed by sealing resin, then the sealing and protection are improved, but the ease of removal and replacement deteriorates

Engineering Contradiction:
Improvesealing protectionVSAvoidease of removal
Core Design Contradiction:
ReliabilityVSEase of operation

Solution Approach 1:

The power module structure is divided into separate components: the insulating substrate assembly (containing semiconductor devices and sealing resin) and the case are separated and connected only through elastic members. This segmentation allows the insulating substrate to be removed independently from the case, enabling replacement of semiconductor devices without replacing the entire case assembly.

Inventive Principle:
Principle #1Segmentation

2Stability of the object's composition

If the insulating substrate and case are integrally formed, then the structural stability is improved, but the replacement cost increases

Engineering Contradiction:
Improvestructural stabilityVSAvoidreplacement cost
Core Design Contradiction:
Stability of the object's compositionVSEase of repair

Solution Approach 1:

By separating the insulating substrate assembly from the case and connecting them only through elastic members, the design enables selective replacement of the insulating substrate (containing failed semiconductor devices) while retaining the case. This reduces replacement costs by avoiding unnecessary replacement of the case assembly.

Inventive Principle:
Principle #1Segmentation

3Reliability

If the semiconductor device and case are firmly connected, then the connection reliability is improved, but the ease of replacement deteriorates

Engineering Contradiction:
Improveconnection reliabilityVSAvoidease of replacement
Core Design Contradiction:
ReliabilityVSEase of operation

Solution Approach 1:

Elastic members are used to connect the insulating substrate to the case, providing a dynamic connection that maintains reliable electrical and mechanical contact during operation but allows for easy separation when replacement is needed. The elastic nature enables firm connection during use while facilitating removal when required.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design reduces operational and member replacement costs by facilitating easy removal and replacement of the insulating substrate and case, improving the efficiency of the replacement process and maintaining contact pressure with heat sinks.

Implementation Method 1

an elastic member that connects the case and the end portion of the internal terminal

Methodology Applied
Scientific EffectElasticity: Elasticity

Data Source

PatentUS10515863B2Power module and power conversion apparatus including case and elastic member
Publication Date: 2019.12.24 MITSUBISHI ELECTRIC CORP
  • US10515863B2 patent drawing
  • US10515863B2 patent drawing
  • US10515863B2 patent drawing

AI summary

According to the present invention, a power module includes an insulating substrate, a semiconductor device provided on the insulating substrate, an internal terminal provided on the insulating substrate and electrically connected to the semiconductor device, a sealing material that seals the internal terminal, the semiconductor device and the insulating substrate so that an end portion of the internal terminal is exposed, a case that is separate from the sealing material and covers the sealing material and an elastic member that connects the case and the end portion of the internal terminal.