Power Module Case With Elastic Intermediate Member
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Solution Overview
Problem
The existing power modules for hybrid and electric automobiles face challenges in improving productivity, terminal connection reliability, reducing size, and enhancing heat radiation properties for semiconductor devices housed in cases.
Innovation Solution
A power module configuration that includes a sealing body with a semiconductor element, conductor plates, and a case with heat radiation plates connected by an intermediate member that can be elastically deformed, allowing for improved heat dissipation and secure fixation, along with a manufacturing method that involves elastic deformation and pressurization to ensure precise fitting and sealing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a resin-molded semiconductor device is housed in a case, then productivity and reliability of terminal connection should be improved, but the housing process is complex and time-consuming
Solution Approach 1:
The case is designed with an elastic deformable portion that can dynamically change shape during the housing process. The case is pressed to deform the elastic portion, allowing the semiconductor device to be inserted, and then the elastic force automatically restores the case to its original shape, securing the device in place. This dynamic mechanism eliminates complex fastening steps while ensuring reliable terminal connections.
Solution Approach 2:
The elastic deformable portion of the case provides self-service functionality by automatically securing the semiconductor device through elastic restoration. After the device is inserted by pressing the case, the elastic force automatically returns the case to its original shape, creating a self-locking mechanism that secures the device without additional fastening operations, thereby improving productivity.
2Temperature
If heat radiation plates are added to both sides of the semiconductor device, then heat radiation properties are improved, but the device size increases
Solution Approach 1:
The case is designed to serve multiple functions: it provides mechanical protection for the semiconductor device, secures the device through elastic deformation, and acts as a heat radiation plate on both sides. By integrating the heat radiation function into the case structure itself, additional heat radiation plates are eliminated, preventing increase in device size while maintaining excellent heat radiation properties.
3Reliability
If the case structure is made rigid for secure fixation, then reliability of housing is improved, but ease of insertion and productivity are reduced
Solution Approach 1:
The case incorporates an elastic deformable portion that transitions between flexible and rigid states. During insertion, the case is pressed to deform the elastic portion, making it flexible and easy to insert the semiconductor device. After insertion, the elastic force restores the case to its rigid original shape, providing secure fixation. This dynamic state change resolves the contradiction between rigidity for reliability and flexibility for ease of insertion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances productivity, reliability of terminal connections, and heat radiation properties, leading to a more efficient and compact power module design for automotive applications.
Implementation Method 1
the sealing body is pressed against and fixed to the second heat radiation plate via the first heat radiation plate by elastic force generated in the first thin section
Data Source
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AI summary
A power module includes: a sealing body including a semiconductor element having a plurality of electrode surfaces, a first conductor plate connected to one electrode surface of the semiconductor element via solder, and a sealing material for sealing the semiconductor element and the first conductor plate, the sealing body having at least a first surface and a second surface on the opposite side of the first surface; and a case for housing the sealing body. The case is configured by a first heat radiation plate opposed to the first surface of the sealing body, a second heat radiation plate opposed to the second surface of the sealing body, and an intermediate member that connects the first heat radiation plate and the second heat radiation plate. The intermediate member has a first thin section having thickness smaller than the thickness of the first heat radiation plate, more easily elastically deformed than the first heat radiation plate, and formed to surround the first heat radiation plate. The sealing body is pressed against and fixed to the second heat radiation plate via the first heat radiation plate by elastic force generated in the first thin section.