Power Module Case With Recessed Portions For Dual-Side Cooling
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Solution Overview
Problem
Existing power conversion devices face challenges in maintaining pressure resistance while achieving efficient cooling for high-power semiconductor elements, leading to increased device size and potential insulation issues.
Innovation Solution
A power-module device with a case having recessed portions for semiconductor components, where cooling devices are arranged on both sides of the case to interpose the components, and a sealing material is used to ensure pressure resistance and prevent fluid leakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If semiconductor components are alternately arranged with cooling devices to improve cooling efficiency, then cooling efficiency is improved, but pressure resistance is not sufficiently ensured
Solution Approach 1:
The patent transitions from simple alternating arrangement to a three-dimensional integrated structure where the case has recessed portions that receive semiconductor components, with cooling devices positioned on opposite sides. This spatial reorganization maintains cooling efficiency while improving pressure resistance through the integrated case structure.
Solution Approach 2:
The case structure merges multiple functions: it provides mechanical support, creates recessed portions for semiconductor components, positions cooling devices, and ensures pressure resistance. The sealing material is integrated into the case structure to prevent fluid leakage, combining sealing function with the structural framework.
2Strength
If space is increased for insulation between semiconductor elements to ensure pressure resistance, then pressure resistance is improved, but device size increases
Solution Approach 1:
The case structure utilizes vertical recessed portions to position semiconductor components at different heights, creating insulation spaces in the vertical dimension rather than requiring horizontal spacing. This allows compact horizontal arrangement while maintaining adequate insulation distances for pressure resistance.
3Volume of stationary object
If semiconductor components are densely arranged to improve space utilization, then device compactness is improved, but insulation between components deteriorates
Solution Approach 1:
The case is segmented into multiple recessed portions, each dedicated to housing a semiconductor component. This segmentation naturally creates isolated compartments that provide adequate insulation between components while maintaining compact overall device dimensions.
Solution Approach 2:
By arranging semiconductor components in vertical recessed portions rather than horizontal placement, the design achieves dense packing in the horizontal plane while maintaining sufficient vertical insulation distances. The cooling devices are positioned on opposite sides of the case, providing both cooling and insulation functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for high-pressure resistance while maintaining efficient cooling of semiconductor elements, minimizing device size and ensuring reliable insulation and sealing.
Implementation Method 1
a sealing material is arranged on one side of the case. The case has an integral structure so that the sealing material can be held on the one side up to at least a portion of the edge portion
Implementation Method 2
The multiple semiconductor components are respectively arranged in the respective recessed portions so as to be interposed between cooling devices via the case from both sides
Data Source
AI summary
In order to efficiently cool a heat-generating semiconductor element, it is desirable to cool a power semiconductor element from both surfaces. Therefore, in order to cool multiple power semiconductor elements, it is an effective way to alternately arrange a semiconductor component having the incorporated semiconductor element and a cooling device. A power conversion device for handling a high-power voltage needs to ensure pressure resistance between semiconductor elements or circuits inside the device. It is an effective way to seal the semiconductor component with a sealing material such as a silicone gel. Therefore, it is necessary to install the semiconductor component or the circuit having the incorporated semiconductor element, in a case from which a liquid silicone gel prior to curing does not leak even if the gel is injected. For these reasons, an object to be achieved by the invention is that the semiconductor element can be cooled from both surfaces by alternately arranging the semiconductor component having the incorporated semiconductor element and the cooling device. The above-described object can be achieved as follows. A substantially rectangular thin plate is subjected to mountain bending and valley bending so as to form a shape having as many recesses as the number of the mounted semiconductor components having the incorporated semiconductor element. Concurrently, a lateral side in a direction orthogonal to the above-described bending direction is bent so as to dispose the case in which all edges configuring an outer shape of the thin plate are arranged on substantially the same plane. The semiconductor component having the incorporated semiconductor element is arranged at a position serving as the recess of the case. The cooling devices are arranged so as to interpose the semiconductor component having the incorporated semiconductor element via the case. The semiconductor component having the incorporated semiconductor element is sealed with a silicone gel. In addition, preferably, the case is configured to include metal which has high heat conductivity. More preferably, the case is configured to include aluminum, copper, or an alloy whose principal components are both of these.