Power Module Casing Protrusions for Thermal Stress Compensation
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Solution Overview
Problem
Existing power device module packages face challenges in thermal management and reliability due to thermal stress, which can lead to failure, especially at high temperatures, and there is a need for innovative solutions to mitigate damage from plastic deformation and warping during assembly.
Innovation Solution
The use of a frame with a unique open four-sided box-like structure featuring protrusions and dimples on its edges, which act as spring-like compensators to absorb stress and prevent its propagation to the electronic substrate, thereby reducing the risk of damage and enhancing thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a rigid frame structure is used to support the electronic substrate, then structural strength is improved, but thermal stress propagation causes damage to the substrate
Solution Approach 1:
The patent applies this principle by incorporating protrusions and dimples on the frame panels that create a flexible, spring-like structure. These features allow the rigid frame to deform elastically under thermal stress, absorbing stress energy and preventing stress propagation to the electronic substrate while maintaining overall structural strength.
Solution Approach 2:
The patent applies this principle by pre-configuring the frame with protrusions and dimples that act as built-in stress absorbers. These features are designed beforehand to compensate for thermal expansion and contraction forces, cushioning the substrate against stress damage before stress can propagate through the rigid frame structure.
2Reliability
If protrusions and dimples are added to the frame panels, then stress absorption is improved, but manufacturing complexity increases
Solution Approach 1:
The patent applies this principle by dividing the frame panels into segments with repeated protrusion and dimple patterns. This segmentation allows the complex stress-absorbing structure to be manufactured using standardized, repeatable processes rather than requiring complex custom tooling for each frame component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces the risk of damage from thermal stress and deformation, ensuring improved reliability and performance of power electronic substrates in high-power applications by effectively managing thermal and mechanical stresses during assembly and operation.
Implementation Method 1
The protrusions can act as spring-like compensators that compensate plastic deformation, and twisting or warping of the package cover or of the frame, to prevent the stress from propagating to the attached substrate.
Data Source
AI summary
A method includes disposing a series of protrusions on a rectangular side panel of an open four-sided box-like structure in a frame, and attaching an electronic substrate to the frame. The electronic substrate carries one or more circuit components. The series of protrusions acts as a spring-like compensator to compensate plastic deformation, twisting or warping of the frame, and to limit propagation of stress to the electronic substrate via the frame.