Power Module Package With Cavity Cooling for Dual-Side Heat Removal
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Solution Overview
Problem
Conventional power module packages face challenges with thermal management due to high power dissipation and low cooling efficiency, particularly with silicon carbide (SiC) devices, which require advanced package designs and complex cooling solutions to manage heat effectively.
Innovation Solution
A power module package design featuring a first and second lead frame with a chip in between, attached heat spreaders forming an enclosure with an inlet and outlet for a cooling medium, allowing direct contact and efficient heat transfer through fins and dielectric liquid vaporization for enhanced cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional wire-bond interconnection scheme is used, then electrical connection is achieved, but package volume increases due to height of bond wires and single side cooling is limited
Solution Approach 1:
The patent merges the interconnection function and cooling function into a single integrated DBC substrate structure. The DBC substrate simultaneously provides electrical interconnection between power devices and serves as a heat spreading platform with integrated cold plates for both top and bottom cooling, eliminating the need for separate wire bonds and independent cooling components.
Solution Approach 2:
The DBC substrate performs multiple functions: electrical interconnection, heat spreading, and structural support for dual-side cooling. The integrated design allows the same substrate to handle both power signal transmission and thermal management, enabling dual-side cooling capability without increasing package volume.
2Temperature
If two DBC substrates with separate cold plates are used for double side cooling, then cooling capability is improved, but structure becomes complex and weight increases
Solution Approach 1:
The patent combines multiple cooling components (DBC substrates, cold plates, and mounting structures) into a single integrated DBC substrate assembly. The top and bottom cold plates are directly bonded to opposite sides of the DBC substrate, creating a unified structure that provides dual-side cooling without requiring separate mounting brackets, additional fasteners, or complex assembly procedures.
3Temperature
If liquid immersion bath system is used for cooling, then cooling capacity is increased, but system complexity increases and cooling efficiency decreases
Solution Approach 1:
The patent extracts the cooling function from the external liquid immersion bath system and integrates it directly into the power module package structure. By incorporating cold plates and heat spreaders within the package itself, the design eliminates the need for external immersion baths, pumps, and complex fluid circulation systems while achieving more efficient direct heat transfer at the source.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves high chip-level cooling efficiency, reducing the package size and weight while improving cooling performance, making it suitable for high-power applications like aerospace and automotive systems.
Implementation Method 1
allowing direct contact and efficient heat transfer through fins and dielectric liquid vaporization for enhanced cooling efficiency
Implementation Method 2
efficient heat transfer through fins and dielectric liquid vaporization for enhanced cooling efficiency
Data Source
AI summary
Abstract: Various embodiments may relate to a power module package. The power module package may include a power module including a first lead frame, a second lead frame, and at least one chip at least partially between the first lead frame and the second lead frame. The power module package may also include a first heat spreader attached to the first lead frame. The power module package may further include a second heat spreader also attached to the first lead frame such that the first lead frame, the first heat spreader and the second heat spreader form an enclosure defining a cavity containing the at least one chip. The enclosure may include an inlet configured to allow a cooling medium to flow into the cavity and an outlet configured to allow the cooling medium to flow out of the cavity.