Power Module Chip Layout for Isolated Electrical Testing
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Solution Overview
Problem
In high-voltage power modules used in electric vehicles, the yield of semiconductor chips such as MOSFETs and IGBTs is low due to defects in electrical tests, where even non-defective chips are treated as defective, leading to decreased efficiency.
Innovation Solution
The semiconductor device is designed with a single semiconductor chip per insulating plate, using multiple metal plates and encapsulating materials to improve heat dissipation and electrical connectivity, reducing the likelihood of defective treatments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple semiconductor chips are mounted on a single insulating plate, then productivity increases, but reliability decreases due to defects in electrical tests treating non-defective chips as defective
Solution Approach 1:
The insulating plate is divided into multiple mounting regions (first mounting region and second mounting region) separated by a groove. This segmentation isolates electrical test signals between regions, preventing false defect detections and enabling higher mounting density without compromising yield.
2Productivity
If multiple semiconductor chips are mounted on a single insulating plate, then productivity increases, but manufacturing precision decreases due to electrical test interference
Solution Approach 1:
The groove physically divides the mounting areas, creating isolated electrical zones. This segmentation prevents signal interference during electrical testing, ensuring accurate defect detection even with multiple chips per plate.
Solution Approach 2:
The groove acts as an intermediary barrier between mounting regions, blocking electrical signal interference and enabling accurate testing of multiple chips simultaneously.
3Reliability
If heat dissipation is improved through additional metal plates, then reliability increases, but device complexity increases
Solution Approach 1:
The groove structure serves dual purposes: it separates mounting regions for electrical isolation and simultaneously functions as a heat dissipation pathway. This merging of functions improves reliability without proportionally increasing complexity.
Solution Approach 2:
The groove structure performs multiple functions: electrical isolation between regions and heat dissipation from the insulating plate. This multi-functionality achieves reliability improvement without adding separate dedicated components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the yield by avoiding non-defective chips from being classified as defective, thereby improving the overall efficiency and reliability of the semiconductor devices.
Implementation Method 1
a first metal plate provided on a first surface of the first insulating plate, a second metal plate provided on a second surface of the first insulating plate... the number of semiconductor chips provided on the second metal plate is only one
Data Source
AI summary
A semiconductor device according to an embodiment includes a first insulating plate, a first metal plate provided on a first surface of the first insulating plate, a second metal plate provided on a second surface of the first insulating plate opposite the first surface, a semiconductor chip provided on the second metal plate, and a resin member encapsulating the semiconductor chip. In this semiconductor device, the number of semiconductor chips provided on the second metal plate is only one.