Power Module Layout With Circular Arm Circuits for Low Inductance
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Solution Overview
Problem
Existing power modules have high inductance, which hinders efficient power conversion and energy consumption.
Innovation Solution
A power module design with arm circuits overlapping a circle around the input terminal, utilizing an insulation substrate with specific wiring patterns and switching elements connected in series, reducing current path differences and inductance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional power module layout is used, then manufacturing and wiring are simplified, but inductance is high which reduces power conversion efficiency
Solution Approach 1:
The patent transitions from planar 2D layout to 3D stacked configuration, placing switching elements vertically above each other on the insulation substrate. This vertical stacking reduces current path length and loop area, thereby reducing inductance while maintaining manufacturing feasibility through standardized mounting processes.
Solution Approach 2:
The patent employs circular wiring patterns and annular current paths instead of straight linear traces. The circular geometry around the input terminal creates more uniform current distribution and reduces edge effects, lowering parasitic inductance while keeping the wiring pattern manufacturable with standard PCB techniques.
2Loss of energy
If inductance is reduced through optimized layout, then power conversion efficiency improves, but device complexity increases
Solution Approach 1:
The insulation substrate serves multiple functions simultaneously: it provides electrical insulation between switching elements, acts as a mechanical support structure, and functions as a wiring carrier with integrated circular traces. This multi-functionality reduces the need for additional components and simplifies the overall device structure despite the optimized layout.
Solution Approach 2:
The patent combines the input terminal, switching elements, and wiring patterns into a tightly integrated modular unit. The first and second input terminals are positioned adjacently with switching elements stacked between them, merging what would traditionally be separate functional blocks into a compact assembly that achieves low inductance without proportionally increasing complexity.
3Loss of energy
If switching elements are connected in series with optimized wiring, then inductance decreases, but manufacturing precision requirements increase
Solution Approach 1:
The circuit is divided into modular segments: input terminals, switching element modules, and output connections. Each segment can be manufactured and tested independently before final assembly, allowing precision requirements to be managed at each stage rather than requiring ultra-high precision across the entire circuit in a single manufacturing step.
Solution Approach 2:
The patent changes the geometric parameters of the wiring pattern from conventional rectangular traces to circular and annular shapes with optimized radii. These parameter changes are designed to minimize inductance while remaining within the manufacturing capabilities of standard PCB fabrication processes, balancing performance improvement with manufacturing precision requirements.
Data Source
AI summary
A power module includes a insulation substrate, a first and a second input terminal supported by the insulation substrate, a plurality of arm circuits provided on the insulation substrate, and a plurality of output terminals corresponding to the plurality of arm circuits. The arm circuits each include a part of a wiring pattern formed on the insulation substrate, and a first switching element and a second switching element mutually connected in series via the part of the wiring pattern. The output terminals are each connected to a connection point between the first switching element and the second switching element in a corresponding one of the plurality of arm circuits. The plurality of arm circuits are located so as to overlap with a circle surrounding the first input terminal, as viewed in a thickness direction the insulation substrate.