Power Module Clip Protrusions for Stable Reflow Positioning

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Solution Overview

Problem

During conventional clip bonding processes for semiconductor dies, controlling the clip position during reflow is challenging, leading to unreliable contacts and module formation due to potential movement of the clip.

Innovation Solution

A power electronic module design that includes a substrate, a semiconductor die, and a clip member with a base portion and an extender portion. The clip member features protrusions that extend from the base or extender portion, allowing it to be securely positioned using guide members or slots on the substrate during reflow.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conventional clip bonding process is used, then the manufacturing process is simple, but the clip position cannot be controlled during reflow leading to unreliable contacts

Engineering Contradiction:

Improvecontact reliabilityVSAvoidclip structure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The clip member is divided into distinct functional portions: a base portion that contacts the semiconductor die, an extender portion that extends downward, and a contact portion that contacts the substrate. This segmentation allows each portion to perform its specific function independently, ensuring the clip maintains position during reflow while keeping the overall structure manageable

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The protrusions are pre-formed on the clip member before the bonding process. These protrusions engage with corresponding features on the substrate or guide members in advance, establishing position control before reflow occurs, thereby preventing movement during the heating process

Inventive Principle:

Principle #10Preliminary action

2Manufacturing precision

If the clip structure is simplified, then the manufacturing is easier, but the clip moves out of position during reflow

Engineering Contradiction:

Improveclip position accuracyVSAvoidclip manufacturing difficulty

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The clip member incorporates protrusions at specific locations rather than requiring complex overall geometry. These localized features provide precise positioning functionality without necessitating complicated clip designs, thereby achieving high manufacturing precision through simple, targeted structural modifications

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The protrusions act as intermediary elements that mediate between the clip member and the substrate or guide members. These intermediate features enable precise position control by engaging with corresponding recesses or features, allowing accurate positioning without requiring complex direct coupling mechanisms

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS12283562B2Clip design and method of controlling clip position

Publication Date: 2025.04.22 SEMICON COMPONENTS IND LLC

AI summary

According to an aspect, a power electronic module includes a substrate, a semiconductor die coupled to the substrate, and a clip member configured to secure the semiconductor die to the substrate, where the clip member includes a base portion having a surface coupled to the semiconductor die, an extender portion that extends from the base portion, where the extender portion includes a contact portion coupled to the substrate, and at least one protrusion that extends from the base portion or the extender portion.