Multi-Die Power Module Cluster Activation for Thermal Balance
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Solution Overview
Problem
Multi-die power modules face challenges in balanced load current sharing and temperature distribution due to inherent die characteristics and geometric location on substrates, leading to inefficient utilization and increased costs, weight, and power consumption.
Innovation Solution
The system groups dies into clusters based on their location and cooling abilities, varying activation patterns to balance electrical losses and temperatures across clusters, allowing for open-loop control without individual temperature sensing, thereby optimizing current sharing and extending module lifetime.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If parallel connected dies are used to increase current capability, then current capability is improved, but temperature distribution becomes unbalanced
Solution Approach 1:
The patent applies local quality by assigning different activation patterns to different clusters of dies based on their thermal characteristics. Dies in clusters with poorer thermal dissipation are activated less frequently or for shorter durations, while dies in clusters with better thermal dissipation are activated more. This localized control strategy balances the temperature distribution across the module while maintaining high current capability.
2Temperature
If feedback control is implemented to balance die temperatures, then temperature balancing is improved, but device complexity increases
Solution Approach 1:
The patent implements preliminary action by pre-defining multiple activation patterns corresponding to different thermal conditions before operation begins. During operation, the controller simply selects and applies the appropriate pre-defined pattern based on thermal sensor readings or predetermined thermal zones, rather than implementing complex real-time feedback control. This approach achieves temperature balancing while keeping the control system relatively simple.
3Power
If more dies are added in parallel to achieve given current rating, then current capability is improved, but cost and physical surface area increase
Solution Approach 1:
The patent applies dynamics by implementing time-varying activation patterns for different clusters of dies. Instead of all dies operating continuously at full capacity, the controller dynamically adjusts which dies are active and for how long based on thermal conditions. This allows the module to achieve high current ratings using fewer physical dies, as the same dies can be cycled through different activation patterns to distribute thermal load and prevent overheating.
Data Source
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AI summary
The present invention concerns a system comprising a multi-die power module composed of dies and a controller receiving plural consecutive input patterns for activating the dies of the multi-die power module. The dies are grouped into plural clusters of dies and the controller comprises means for outputting one gate to source signals for each cluster of dies, each outputted gate to source signal being different from the other gate to source signals and at least one first outputted gate to source signal reducing the activation of dies during at least one input pattern among the plural input patterns.