Power Module Compensation Layer for Low Intrinsic Inductance

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing power modules face challenges in reducing intrinsic inductance, which affects performance, efficiency, ampacity, reliability, and manageability, particularly in high-voltage applications.

Innovation Solution

A power module with a partially electrically insulating layer and a conductive compensation layer applied to its opposite side, which is connected to an electric potential, is used to reduce intrinsic inductance by compensating for it.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional power module structure is used, then manufacturing simplicity is maintained, but intrinsic inductance remains high affecting performance

Engineering Contradiction:
ImproveperformanceVSAvoidmodule structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The module structure is segmented into distinct functional layers: a first substrate for power electronics components, a second substrate for signal processing, and an intermediate insulating layer. This segmentation allows independent optimization of each layer while reducing overall intrinsic inductance through controlled impedance management.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

An intermediate insulating layer with specific dielectric properties is introduced between the first and second substrates. This intermediary layer serves as a mediator that controls electromagnetic field distribution, reduces parasitic inductance, and maintains electrical isolation while enabling improved signal integrity and power delivery.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Power

If high voltage handling capability is increased, then power conversion performance improves, but intrinsic inductance effects become more significant

Engineering Contradiction:
Improvevoltage handling capabilityVSAvoidinductance control
Core Design Contradiction:
PowerVSReliability

Solution Approach 1:

The dielectric constant and loss tangent parameters of the insulating layer are specifically optimized to change the electromagnetic field distribution characteristics. By adjusting these material parameters, the design achieves reduced parasitic inductance effects while maintaining high voltage handling capability through controlled impedance management.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The module employs composite material construction with the insulating layer having specific dielectric properties positioned between conductive substrates. This composite structure creates favorable electromagnetic field distribution that reduces intrinsic inductance while maintaining high voltage isolation, enabling improved power handling with reduced inductive effects.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces intrinsic inductance, enhancing performance, efficiency, ampacity, reliability, and manageability of power modules, especially in high-voltage environments.

Implementation Method 1

the intrinsic inductance of a power module can be reduced by an electrically conductive compensation layer to which an electric potential is applied

Methodology Applied
Scientific EffectElectromagnetic induction: Electromagnetic Induction

Data Source

PatentUS12452992B2Power module having reduced intrinsic inductance
Publication Date: 2025.10.21 AVL SOFTWARE & FUNCTIONS GMBH
  • US12452992B2 patent drawing
  • US12452992B2 patent drawing
  • US12452992B2 patent drawing

AI summary

A power module having reduced intrinsic inductance has an at least partially electrically insulating layer that has a first surface on which a power electronics unit is arranged and a second surface which is opposite the first surface. The module also has a compensation layer arranged on the second surface, which the compensation layer is electrically conductive and which the compensation layer is electrically connected to the electric potential of the power electronics unit.