Power Module Output Conductor Cooling Without Added Size
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Solution Overview
Problem
Existing power modules face challenges in cooling output conductors without increasing the size of the power conversion device, particularly due to the need for separate cooling structures that can lead to temperature exceedance of current sensors.
Innovation Solution
The power module incorporates a substrate with circuit and non-circuit pattern sections, where the output conductor has a base portion connected to both sections, allowing heat to be conducted away through a second connection portion to a non-circuit pattern section, thereby eliminating the need for additional cooling structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a separate cooling structure is provided for the output conductor, then the output conductor can be cooled effectively, but the power conversion device increases in size
Solution Approach 1:
The patent merges the cooling function into the existing substrate structure by creating a non-circuit pattern section that is thermally conductible to the output conductor. This eliminates the need for separate cooling structures while maintaining effective heat dissipation from the output conductor.
Solution Approach 2:
The substrate is designed to serve multiple functions: it provides electrical insulation through the non-circuit pattern section while simultaneously providing thermal conduction to cool the output conductor. This multi-functionality eliminates the need for dedicated cooling components.
2Temperature
If the output conductor is cooled using existing cooler structures, then heat dissipation is improved, but the current sensor may still exceed its operating temperature range
Solution Approach 1:
The patent applies local quality by creating a specific non-circuit pattern section with thermally conductible properties positioned adjacent to the output conductor. This localized thermal conduction path directly cools the output conductor and surrounding areas, including the current sensor region, without requiring system-wide cooling modifications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively cools the output conductor while preventing an increase in device size, maintaining the temperature of current sensors within operational limits.
Implementation Method 1
a second connection portion extending from the base portion to reach the non-circuit pattern section and is connected to the non-circuit pattern section in a thermally conductible manner
Data Source
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AI summary
A power module includes: an input conductor; a power semiconductor element which converts a voltage input from the input conductor; a substrate on which the power semiconductor element is mounted; and an output conductor which outputs the voltage converted by the power semiconductor element, wherein the substrate includes a circuit pattern section which is provided with a circuit pattern electrically connected to the power semiconductor element and a non-circuit pattern section which is electrically insulated from the circuit pattern section, and wherein the output conductor includes a base portion, a first connection portion which extends from the base portion to reach the circuit pattern section and is electrically connected to the circuit pattern section, and a second connection portion which extends from the base portion and is connected to the non-circuit pattern section in a thermally conductible manner.