Power Module Electrodeposition for Complex Connection Pillars

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Solution Overview

Problem

Conventional electrochemical deposition manufacturing processes are unable to fully create parts with complex features such as electrical power modules and electronics packages effectively.

Innovation Solution

A method involving an electrochemical deposition system where a base plate with a metallic layer is positioned in an electrolyte solution, and a deposition anode array is used to deposit material onto the metallic layer, forming electrical connection pillars, encapsulant retention features, and heat exchange features, utilizing a power source to control the deposition process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional electrochemical deposition manufacturing processes are used, then parts can be manufactured with additive manufacturing capabilities, but complex features such as electrical connection pillars and heat exchange structures cannot be fully created

Engineering Contradiction:
Improvecomplex feature creation capabilityVSAvoidmanufacturing capability limitation
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The deposition anode array is divided into multiple independently controllable deposition anodes arranged in specific patterns. Each deposition anode can be independently energized to deposit material at specific locations, enabling the creation of complex features like electrical connection pillars and heat exchange structures with precise spatial control that conventional electrochemical deposition cannot achieve

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the cathode receive different deposition conditions by selectively energizing specific deposition anodes. This allows different features (electrical connection pillars, heat exchange structures, encapsulant retention features) to be created with locally optimized material properties and geometries, achieving high manufacturing precision for complex features

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables the creation of electrical power modules and electronics packages with precise, complex features like electrical connection pillars and heat exchange structures, enhancing manufacturing capabilities beyond conventional methods.

Implementation Method 1

electrochemical deposition manufacturing processes utilize electrochemical reactions to manufacture parts in an additive manufacturing manner. In an electrochemical deposition manufacturing process, a metal part is constructed by plating charged metal ions onto a surface of a cathode in an electrolyte solution

Methodology Applied
Scientific EffectElectrochemical deposition: Electrodeposition

Implementation Method 2

transmitting electrical energy from the power source through the one or more deposition anodes of the plurality of deposition anodes, through the electrolyte solution, and to the first metallic layer

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS20260052915A1Methods of making an electrical power module and electronics package
Publication Date: 2026.02.19 FABRIC8LABS INC
  • US20260052915A1 patent drawing
  • US20260052915A1 patent drawing
  • US20260052915A1 patent drawing

AI summary

A method of making an electronics package for an electrical power module includes positioning a base plate into an electrolyte solution such that a first metallic layer of the base plate directly contacts the electrolyte solution. The method also includes positioning a deposition anode array into the electrolyte solution such that a gap is established between the first metallic layer and the deposition anode array. The method further includes connecting the first metallic layer to a power source and connecting the deposition anode array to the power source. The method also includes transmitting electrical energy from the power source through the deposition anode array, through the electrolyte solution, and to the first metallic layer, such that material is deposited onto the first metallic layer and forms an electrical connection pillar, an electrical-component retention feature, and an encapsulant retention feature of the electronics package.