Power Module Contact Elements Perpendicular to Substrate
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Solution Overview
Problem
Power modules in electric vehicles experience high voltage peaks due to leakage inductance during switching, which can cause circuit-breakers and power semiconductors to fail, despite advancements in wide-bandgap semiconductors enabling short switching times.
Innovation Solution
The power module design includes contact elements on the same metal layer as circuit-breakers, with these elements extending perpendicular to the surface, reducing leakage inductance and voltage peaks by minimizing electrical line lengths, and incorporating a substrate with insulating and metal layers for improved insulation and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If wide-bandgap semiconductors are used to achieve short switching times, then switching speed is improved, but voltage peaks increase causing circuit-breaker failure
Solution Approach 1:
An intermediate circuit capacitor is introduced as a mediator component between the power semiconductors and the load. This capacitor absorbs the voltage peaks generated during switching operations, protecting the circuit-breakers and power semiconductors from damage while enabling the use of wide-bandgap materials for short switching times.
Solution Approach 2:
The intermediate circuit capacitor serves as a cushioning element that is pre-positioned in the circuit to absorb and dampen voltage spikes before they can damage the circuit-breakers. This protective measure is built into the module structure in advance, allowing aggressive switching with wide-bandgap semiconductors without compromising reliability.
2Object-generated harmful factors
If contact elements are placed on the same metal layer as circuit-breakers, then leakage inductance is reduced, but manufacturing complexity increases
Solution Approach 1:
The contact elements for DC current input are merged with the circuit-breaker mounting layer, eliminating the need for separate connection layers. This integration reduces the number of electrical connections and minimizes leakage inductance by shortening current paths, while the modular substrate structure keeps manufacturing manageable.
Solution Approach 2:
The contact elements extend perpendicular to the substrate surface, utilizing the vertical dimension to establish direct electrical connections. This three-dimensional arrangement reduces inductance by minimizing current loop areas, while the layered substrate structure provides a systematic approach to manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces the risk of circuit-breaker failure from voltage peaks, allowing for efficient use of short switching times with wide-bandgap semiconductors, enhancing the performance and reliability of the power module.
Implementation Method 1
compensation for voltage peaks occurring during the switching on and off of the circuit-breakers by an intermediate circuit capacitor of the power module
Implementation Method 2
substrate with insulating and metal layers for improved insulation and heat dissipation
Data Source
AI summary
A power module (10) for operating an electric vehicle drive includes a current input configured for supplying an input current. The current input includes multiple contact elements (182, 184). Multiple circuit-breakers (142, 144) are configured for generating an output current based on the supplied input current. A current output (192) is configured for outputting the output current at a consumer. A substrate (12) includes a metal layer (122-130) and an insulating layer (121) connected to the metal layer (122-130). The multiple circuit-breakers (142, 144) are arranged on the metal layer (122-130). The multiple contact elements (182, 184) are also arranged on the metal layer (122-130) such that the multiple contact elements (182, 184) extend perpendicular to a surface of the substrate (12).