Molded Power Module Contact Layout for Low Inductance Isolation
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Solution Overview
Problem
Existing molded power semiconductor modules face challenges in reducing inductance and minimizing damage to power contacts during installation, which increases costs and requires specialized support, while maintaining proper electrical isolation.
Innovation Solution
A molded power semiconductor module design featuring power contacts arranged laterally with a protrusion part of the molded body providing mechanical support, reducing the need for external supports and optimizing creepage distance for improved electrical isolation and reduced inductance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If power contacts are mechanically pressed during joint fabrication, then welding quality improves, but power contacts may take damage or bend out of shape
Solution Approach 1:
The molded body is designed with built-in support structures that pre-position and support the power contacts before the welding process begins. This preliminary support prevents damage during the subsequent pressing operation, allowing reliable welding without compromising power contact integrity.
2Reliability
If power contacts are arranged at larger distances, then electrical isolation improves, but inductance of the module increases
Solution Approach 1:
The molded body provides localized electrical isolation between power contacts through its insulating material properties in specific regions, rather than requiring uniform large distances. This allows power contacts to be positioned closer together while maintaining adequate electrical isolation through the molded body's structural design.
3Strength
If dedicated support structures are provided for power contacts, then damage prevention improves, but installation costs increase
Solution Approach 1:
The support function for power contacts is merged into the molded body itself, which already serves as the encapsulation structure. By integrating the support function into the existing molded body design, no separate dedicated support structures are needed, reducing component count and installation costs while still providing necessary protection.
4Object-generated harmful factors
If multiple power contacts are arranged laterally close together, then inductance reduces, but electrical isolation between contacts becomes compromised
Solution Approach 1:
The molded body utilizes the vertical dimension to provide electrical isolation between laterally arranged power contacts. By designing the molded body to extend vertically between contacts or provide vertical barriers, adequate creepage and clearance distances are achieved in the vertical direction, enabling closer lateral spacing without compromising isolation.
Data Source
AI summary
A molded power semiconductor module includes: one or more power semiconductor dies; a molded body at least partially encapsulating each power semiconductor die and having opposing first and second sides, and lateral sides connecting the first and second sides; and first and second power contacts arranged laterally next to each other at a first one of the lateral sides of the molded body and electrically coupled to the power semiconductor die(s). The power contacts each have opposing first and second sides, each first side having an exposed part exposed from the molded body, each second side having a part that is arranged in a vertical direction below an outline of the respective exposed part of the first side and that is at least partially covered by a protrusion part of the molded body. The vertical direction is perpendicular to the first and second sides of the power contacts.