Power Module Coolant Flow Monitoring Without Separate Flow Sensors
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Solution Overview
Problem
Existing cooling systems for power semiconductor modules, particularly in aircraft, lack effective monitoring methods to ensure proper coolant flow, relying on temperature-sensitive devices that provide only temperature data without indicating if the coolant flow is within designed parameters, necessitating additional flow sensors.
Innovation Solution
Implementing a monitoring method and unit with integrated temperature sensors along the coolant flow path that measure and compare actual temperature differences with expected values based on module losses and nominal flow conditions to determine coolant flow status, eliminating the need for separate flow sensors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If temperature-sensitive devices are used to monitor cooling systems, then temperature measurement is achieved, but coolant flow status cannot be determined
Solution Approach 1:
The patent changes the parameter being monitored from absolute temperature to temperature difference. By measuring the temperature difference between two points in the coolant flow path and comparing it to an expected temperature difference (calculated from power losses and nominal flow conditions), the system can determine coolant flow status without requiring additional flow sensors. This parameter transformation enables flow status detection using only temperature measurements.
2Reliability
If additional flow sensors are installed to monitor coolant flow, then coolant flow status can be determined, but device complexity and cost increase
Solution Approach 1:
The patent makes the temperature sensors serve multiple functions: they simultaneously measure both the absolute temperature (for thermal management) and the temperature difference (for flow status monitoring). This multi-functionality eliminates the need for separate flow sensors, reducing device complexity and cost while maintaining reliable coolant flow monitoring.
Solution Approach 2:
The patent combines the flow monitoring function with the existing temperature measurement function. By using the same temperature sensors to determine both temperature and flow status through temperature difference measurement, the system merges what would traditionally require separate sensing systems into a single integrated approach.
3Reliability
If multiple temperature sensors are arranged along the coolant flow path, then coolant flow status can be inferred, but device complexity increases
Solution Approach 1:
The temperature sensors arranged along the coolant flow path serve dual purposes: monitoring absolute temperature for thermal management and measuring temperature differences for flow status detection. This multi-functionality justifies the sensor arrangement and eliminates the need for additional dedicated flow sensors.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances coolant flow monitoring by saving space and cost while maintaining redundancy, ensuring reliable coolant flow detection without additional sensors, particularly suitable for aircraft applications.
Implementation Method 1
providing several temperature sensors arranged along the coolant flow path, measuring temperatures at different locations of the coolant flow path by the temperature sensors
Data Source
AI summary
A method for monitoring a cooling system for power electronics, especially on aircraft. For improving monitoring of a cooling system of a power electronic semiconductor device, wherein the cooling system can generate a coolant flow along a coolant flow path over at least one semiconductor power module of the power electronic semiconductor device, the method includes providing several temperature sensors arranged along the coolant flow path, measuring temperatures at different locations of the coolant flow path by the temperature sensors, comparing an actual temperature difference between the temperatures measured with an expected temperature difference calculated on basis of losses of the at least one semiconductor power module and on basis of nominal coolant flow conditions, and determining the status of the coolant flow on basis of the comparison.