Power Module Cooler Layout for Balancing Chip Temperature
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Solution Overview
Problem
In power conversion circuits, variations in heat exchange among semiconductor components lead to increased temperature differences, which can result in inefficient operation and potential overheating, particularly due to differences in cooling performance across the circuit.
Innovation Solution
A semiconductor module configuration is implemented, where a first semiconductor component with a smaller semiconductor chip and heat sink is paired with a second component of a larger chip and heat sink, with the first region of the cooler having higher cooling performance than the second region, thereby balancing heat exchange and reducing temperature differences between components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If semiconductor components of different sizes are disposed in a cooler with uniform cooling performance, then the device complexity is reduced, but the temperature difference between components increases
Solution Approach 1:
The cooler is designed with non-uniform cooling performance where different regions provide different cooling capacities. Specifically, the first region has higher cooling performance than the second region, matching the heat generation characteristics of different semiconductor components. This local differentiation allows smaller components generating less heat to receive stronger cooling, while larger components generating more heat receive proportionally stronger cooling in the second region, thereby balancing temperatures across components of different sizes.
2Ease of manufacture
If all semiconductor components are provided with the same cooling performance, then the manufacturing process is simplified, but heat exchange balance deteriorates
Solution Approach 1:
The cooler incorporates regions with different cooling performances to match the varying heat generation of semiconductor components. The first region provides higher cooling performance for smaller components, while the second region provides lower cooling performance for larger components. This localized differentiation ensures balanced heat exchange across components of different sizes, preventing overheating and improving reliability without requiring complex active control systems.
3Device complexity
If uniform cooling is applied to all semiconductor components, then the system design is simplified, but overheating occurs in smaller components
Solution Approach 1:
The cooler is designed with spatially varying cooling performance where the first region provides stronger cooling for smaller semiconductor components that generate less heat, while the second region provides weaker cooling for larger components that generate more heat. This matches the cooling capacity to the actual heat generation needs of each component type, preventing both overheating of small components and excessive cooling of large components, thereby simplifying the overall thermal management design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses the increase in temperature difference between semiconductor components, optimizing heat dissipation and preventing overheating, which in turn reduces power consumption and minimizes diode deterioration during PWM control.
Implementation Method 1
a first heat conduction surface between the first semiconductor chip and the first heat sink
Implementation Method 2
a cooler with a first region and a second region, wherein the first region has higher cooling performance than the second region
Data Source
AI summary
A first semiconductor component having a first semiconductor chip and a first heat sink and a second semiconductor component having a second semiconductor chip and a second heat sink are disposed in a cooler. The first semiconductor chip is smaller in size than the second semiconductor chip. A first heat conduction surface between the first semiconductor chip and the first heat sink is smaller in an area than a second heat conduction surface between the second semiconductor chip and the second heat sink. A first region of the cooler where the first semiconductor component is disposed has higher cooling performance than a second region of the cooler where the second semiconductor component is disposed.