Power Module Encapsulation Structure for Leak-Free Cooler Sealing
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Solution Overview
Problem
Existing methods for encapsulating power modules and coolers fail to provide a reliable sealed fluid path due to issues such as incomplete laser processing paths, sealing ring degradation, and deformation of components, leading to local leakage and electrical short circuits.
Innovation Solution
The encapsulation structure involves lapping the power module body on a groove of the cooler's fluid pipe, with heat dissipation finned tubes inserted into the groove, and forming a welded sealing ring through simultaneous front and back laser welding, eliminating the need for a separate sealing ring.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a sealing ring is added between the power module and the cooler, then sealing can be achieved, but the sealing ring may be hardened and cracked due to aging or deformation, causing local leakage and electrical short circuit risks
Solution Approach 1:
The patent removes the sealing ring component entirely from the system. Instead of using a separate sealing ring that degrades over time, the sealing function is integrated directly into the metal baseplate through laser welding, creating a permanent seal that eliminates aging and cracking issues.
Solution Approach 2:
The patent replaces the mechanical sealing ring system with a laser welding process. The sealing is achieved through high-energy laser welding that fuses the metal baseplate to the cooler housing, substituting a mechanical sealing approach with a thermal joining process that creates a more reliable, permanent seal.
2Strength
If local high-energy heating is performed by using a laser beam to establish a welding pool, then welding can be achieved, but a continuous laser processing optical path cannot be formed due to the power pin extending from the side
Solution Approach 1:
The patent transitions from two-dimensional surface welding to three-dimensional enclosed chamber welding. By creating a closed cavity that encloses the laser processing path, the laser can operate continuously through the three-dimensional space, avoiding interruptions from external components like power pins.
Solution Approach 2:
The patent performs preliminary actions by pre-arranging the metal baseplate with protruding portions and pre-forming the closed cavity structure before laser welding. This preparation enables the laser to follow a continuous optical path without needing to stop or reposition for external components.
3Power
If the power module and cooler are encapsulated together to form a whole, then power density is improved, but sealing reliability cannot be ensured due to incomplete laser processing paths and component deformation
Solution Approach 1:
The patent merges the power module and cooler into a single integrated encapsulation structure. The metal baseplate serves dual functions as both the power module substrate and the sealing element, while the closed cavity integrates the fluid channel enclosure, combining multiple functions into unified components.
Solution Approach 2:
The patent employs composite construction by combining the metal baseplate (providing structural support and electrical function) with the closed cavity structure (providing sealing and fluid containment). This composite approach creates a multi-functional integrated system that achieves both power density and sealing reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method achieves a complete and reliable sealed fluid path between the power module and the cooler, enhancing sealing reliability and reducing the risk of leakage and electrical short circuits.
Implementation Method 1
Local high-energy heating is performed by using a laser beam, to establish a welding pool and a welding region
Implementation Method 2
a welded sealing ring is formed through laser welding
Data Source
AI summary
An encapsulation structure of a power module is disclosed in this application, which includes a power module and a liquid cooler. The power module includes a power module body, a metal baseplate, and heat dissipation finned tubes. A front side of the metal baseplate is connected to the power module body, and a back side of the metal baseplate is connected to the heat dissipation finned tubes. The metal baseplate has a protrusion part protruding. There are a plurality of grooves on a fluid pipe of the liquid cooler, a cavity exists between two adjacent grooves of the plurality of grooves, and the cavity is configured to communicate the two adjacent grooves. The power module body is lapped on the groove, a back side of the protrusion part is in contact with an edge surface of the groove, and the heat dissipation finned tubes are placed in the groove.