Power Module Circuit Body Layout for Warp-Resistant Cooling Adhesion

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Solution Overview

Problem

The adhesion between the heat dissipation surface and the cooling member in existing electric circuit bodies is reduced due to warping, leading to degraded heat dissipation.

Innovation Solution

An electric circuit body design that includes a first sheet-shaped member with an embedded portion covered by a sealing material, where the margin is located more inward than the heat dissipation surface, and a cooling member is adhesively attached to this member, ensuring secure attachment even when the circuit body warps.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the cooling member is adhesively attached to the heat dissipation surface in the conventional electric circuit body, then the heat dissipation function is achieved, but the electric circuit body warps causing reduced adhesion and degraded heat dissipation

Engineering Contradiction:

Improveheat dissipationVSAvoidadhesion stability

Core Design Contradiction:

TemperatureVSStability of the object's composition

Solution Approach 1:

The sheet-shaped member is divided into three distinct regions: heat dissipation surface region, margin region, and embedded portion region. This segmentation allows each region to serve its specific function while accommodating warping forces in the embedded portion without affecting the adhesion in the heat dissipation surface region.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the sheet-shaped member are given different properties and positions: the heat dissipation surface region maintains flat contact for thermal conduction, the margin region provides transition space, and the embedded portion is positioned inward to absorb warping deformation without compromising the adhesion of the cooling member.

Inventive Principle:

Principle #3Local quality

2Reliability

If the sheet-shaped member is sealed with sealing material to ensure protection, then the sealing function is achieved, but warping occurs causing the cooling member to detach

Engineering Contradiction:

Improvesealing reliabilityVSAvoidattachment strength

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The embedded portion is pre-positioned inward relative to the margin and heat dissipation surface before sealing occurs. This preliminary positioning ensures that when warping happens during or after sealing, the embedded portion absorbs the deformation while the cooling member remains securely attached to the heat dissipation surface.

Inventive Principle:

Principle #10Preliminary action

3Area of stationary object

If the embedded portion is positioned at the edge of the sheet-shaped member to maximize sealing coverage, then the sealing area is increased, but warping causes loss of cooling member adhesion

Engineering Contradiction:

Improvesealing areaVSAvoidcooling member adhesion

Core Design Contradiction:

Area of stationary objectVSReliability

Solution Approach 1:

The solution moves the embedded portion from a two-dimensional edge position to a three-dimensional inward position within the sheet structure. This dimensional repositioning allows the embedded portion to be covered by sealing material while being positioned deeper inside the module, where it can accommodate warping without affecting the cooling member adhesion at the heat dissipation surface.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design secures the cooling member's attachment, maintaining effective heat dissipation despite warping, thereby preventing degradation.

Implementation Method 1

a second step of inducing a curing shrinkage of the sealing material to locate the margin more inward than the heat dissipation surface

Methodology Applied

Scientific EffectCuring shrinkage:

Implementation Method 2

a first cooling member configured to be adhesively attached to the first sheet-shaped member

Methodology Applied

Scientific EffectAdhesive attachment: Adhesive

Implementation Method 3

a heat dissipation surface as a region to overlap the surface of the first conductor plate

Methodology Applied

Scientific EffectHeat dissipation: Heat Sink

Data Source

PatentUS12506133B2Electric circuit body, power conversion device, and method for manufacturing electric circuit body

Publication Date: 2025.12.23 ASTEMO LTD

AI summary

Provided is an electric circuit body including: a power semiconductor element; a first conductor plate configured to be connected to one surface of the power semiconductor element; a first sheet-shaped member having a first resin insulation layer and configured to at least cover a surface of the first conductor plate; a sealing material configured to seal each of the power semiconductor element, the first conductor plate, and an end of the first sheet-shaped member; and a first cooling member configured to be adhesively attached to the first sheet-shaped member. In the electric circuit body, the first sheet-shaped member includes: an embedded portion where the end of the first sheet-shaped member is covered with the sealing material; a heat dissipation surface as a region to overlap the surface of the first conductor plate; and a margin as a region between the embedded portion and the heat dissipation surface, the margin is located more inward than the heat dissipation surface, and the embedded portion is located more inward than the margin.